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March 2008
print magazine

Siemens E&A for sale
Big changes coming at Siemens E & A as the board of directors at Siemens AG announced Monday that it will divest Siemens E&A into a wholly-owned subsidiary and put it up for sale.

Continued miniaturization of electronic devices energizes the world chip bonder markets
New analysis from Frost & Sullivan, World Chip Bonder Markets, finds that the market earned revenues of $908.7 million in 2006 and estimates earnings will reach $1.7 billion in 2013.

Intel honors 35 companies with Preferred Quality Supplier Award
Winners will be honored at a ceremony in Burlingame, Calif. on March 18.

YESTech Names Scott Roberson regional sales manager
Roberson is responsible for managing sales activity in the southern United States as well as overseeing YESTech's new AOI product line for microelectronics applications.

ECD’s MEGAM.O.L.E.®20 thermal profiler named winner of ITC Award and finalist in SMT VISION Awards
MEGAM.O.L.E.®20 product information will be on display at the Innovative Technology Center at APEX, and the profiler itself can be seen at the ECD booth, 2216.

More Industry News...

 

New finish off to a nice start
Joe Fjelstad

Soldering in the legislatively imposed era of lead-free solder has resulted in some significant challenges being thrust upon the electronics assembly industry. Read more...

Comparing techniques for temperature-dependent warpage measurement
Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer  

Three full-field optical techniques, shadow moiré, fringe projection, and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. Read more...

Providing Stability in Challenging Environments
New Silicone Material Does the Trick
Tara Cary and Brian Toleno, the electronics group of Henkel   

Connecting and disconnecting control boards. Plugging and unplugging cables into computers. Constant vibration onboard automotive modules and construction equipment. All of these conditions can wreak havoc on electronics devices, significantly
reducing their performance or rendering them completely inoperable. To help ensure against bent leads, damaged components from vibration or material degradation inside particularly harsh environments, additional stability is often required. But, delivering this stability in a material medium that cures quickly, integrates seamlessly in-line, is easy to use and aesthetically appealing is a tall order. Read the full white paper...

Link Hamson carries new KIC Explorer thermal profiler
The well proven KIC thermal profiling technology has been further developed and is now available in a really compact unit.

Agilent Technologies RF switch platform can reduce custom-switch development time by half
Agilent Technologies Inc. introduced an RF switch platform designed to simplify the task of defining and building a custom switch matrix.

New Static Locator Launch by Meech International
The lightweight pocket-sized device provides an accurate measurement of static electrical charges over a wide range of voltages.

More Products News...

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