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Siemens E & A For Sale

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Microsoft and HP to Launch Tech Center in Taiwan

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CEC to Eliminate 400 Subsidiaries Within a Year

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Indian Designers Seek to Ride Out U.S. Downturn

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Shinwha to Set Up Plant in Taiwan

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Revenue from Telecom Manufacturing to Touch $6.5 Billion

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Agilent Eliminates Need for Physical Test Points for ICT

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Celestica Announces Two Senior Leadership Appointments

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Kyzen

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Breaking News

Kyzen Corp. celebrates 18 successful years in the electronics industry
Kyzen Corporation celebrates its 18th anniversary on April 1, 2008.

Siplace even speedier and more flexible
As part of its ongoing portfolio restructuring, Siemens AG is planning to convert its Electronics Assembly Systems unit (EA) into a wholly owned, legally independent subsidiary of its Drive Technologies (DT) division through a so-called ‘carve-out’.

ZESTRON Asia/Pacific relocate to larger facility
Located in the Zun Xuan Industrial Park, ZESTRON’s new facility is home to the largest Asia/Pacific application technology center.

Digi-Key signs global distribution agreement with MeshNetics
Digi-Key Corporation and MeshNetics have entered into an agreement for the worldwide distribution of MeshNetics’ ZigBee modules, development boards and development kits.

More Industry News...

IPC Shows
 

Featured Column

Practical selection/problems for SMT adhesives
Bob Willis

Bob Willis

Surface mount technology (SMT) first started with the introduction of mixed technology designs incorporating components mounted on the underside of the circuit board. Read more...

Defect of the Month

Solder Paste Shorts
From Global SMT & Packaging's Defect Troubleshooter 

Featured Article

Solder paste shorts can occur on the surface of the board between pads. This type of defect can result in solder shorts, solder balls or variations in the volume of joints after reflow. Read more...

 New Products Spotlight

Featured ArticleXF3 lead-free solder paste for extended reflow profiles
XF3 completes the family of Cobar products based on Nihon Superior’s patented SN100C-alloy.

Featured ArticleEssemtec introduces more placement efficiency with a batch system
FLX2010-BLV, Essemtec's new SMD pick-and-place machine, addresses the requirements of both prototyping and series production.

EVS International to debut new solder dross series
The new systems replace the popular EVS 3000 and EVS 6000 machines that are market leaders in solder recovery.

Featured Article
FX3 – New high speed chip shooter from Juki
The next generation 60,000 CPH high speed chip shooter from JUKI accomplishes speed, functionality and design.

More Products News...

Do you have a technical solution for the industry?
Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.

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Issue 8.12 / Mar. 26, 2008

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Global SMT& Packaging
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Editor-in-Chief
Trevor Galbraith
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Lu Shuzhen
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