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Editorial Staff
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Case Study: Technology partnership for effective RFID system solutions
Dipl.-Ing. (FH) Florian Hierl
The market for contactless labels has passed through the trough and out the other side—RFID is gaining momentum again: In 2007, 144 million RFID tags were sold in the EU alone. According to a current study of the EU project, “Building Radio Frequency Identification for the Global Environment,” it is expected to reach 90 billion in 15 years. IDTechEx’s analysts identified more than 3,000 RFID projects worldwide in the past year. The market volume gained in this line of business was already worth US$5 billion, in which China had the greatest share with more than 40 percent. The reason for this trend is that all IC cards are equipped with RFID in the scope of the national ID program. Through this alone, RFID has experienced an enormous upturn. Read
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Static control - Training is still the key to success
Bob Willis
The electronics industry is continually faced with problems that take time and money to solve. Many of the problems are by no means new. Possibly they may be areas that were not considered important. Electrostatic discharge (ESD) is just one area that could cause system failure at some point during equipment life unless proper precautions are considered. Read
more...
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| White Paper: Self-aligning, Pb-free CSP corner support |
The Next Big Thing: Self-Aligning, Pb-free Capable Corner Support for CSPs
Brian Toleno, the electronics group of Henkel
In previous writings, I have outlined the case for the use of underfills to enhance CSP support and reduce device stress. While these materials were originally designed to accommodate for coefficient of thermal expansion (CTE) mismatches between the substrate and device, newer generation underfill systems have also found favor among manufacturers seeking to enhance drop test reliability for today’s handheld and mobile devices. As the industry has transitioned to lead-free manufacturing and the resulting solder joints have shown a tendency to be more brittle than their SnPb predecessors, providing additional component protection has become imperative for robust long-term in-field performance. Read more...
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Indium Corporation promotes Damian Santhanasamy to senior technical engineer
Based in Johor, Malaysia, Damian provides technical support to target accounts in Malaysia and Thailand while supporting growth and new product development of Indium Corporation's business throughout the Asia-Pacific region.
IPC initiates scientific dialogue on proposed RoHS expansion
IPC is urging all technical experts from member companies, and other stakeholders in the electronics industry, to participate in a special meeting June 18, 2008, in Brussels to discuss concerns about RoHS expansion.
Ovation Products appoints new president
Advanced technology innovator Ovation Products announced that Neil MacRaild has joined the company as president and will lead Ovation as it continues to expand its product lines, sales channels and global initiatives.
Essemtec appoints new marketing manager
Essemtec AG, manufacturer of surface mount technology production equipment, announced that Florian Schildein has been appointed marketing manager.
STG launches new web portion on redesigned ECT website
The STG portion of the new site features current product and capability information as well as a contactor request for quote (RFQ), worldwide support locations and information about upcoming exhibitions.
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Industry News...
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Issue 8.20
May 22, 2008
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