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News
Interview with Vinnie Mehta, executive director of MAIT, at the World Electronics Forum 2008.

News
WKK Distribution Ltd. signs license agreement with Nihon Superior Co. Ltd.

News
EFD opens new 116,000 square foot facility

News
STI moves into new upgraded facility

News
Nextreme announces new eTEG power generation evaluation kit

News
Creative Materials displays at Printed Electronics USA 2008


Global SMT & Packaging
E-mail: news@globalsmt.net
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Editorial Staff

Editor-in-Chief
Trevor Galbraith
Tel: +44 020 7871 7305 (EU)
Tel: +1 239 567 9736 (US)

Managing Editor
Heather Lackey
Tel: +1 (828) 231 9434

China Regional Editor
Lu Shuzhen
Tel: +86 (351) 652 3813

China Website/eNews Editor
Christine Zhang
Tel: +86 13311021565

India Regional Editor
Debasish Choudhury
Tel: +91 120 6453260

UK Regional Editor
Jade Po Kellard
Tel: +44 (0) 1202 388997

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Featured column

A visit to CERN (and the impressive electronics R&D center hidden within)
Joe Fjelstad

In October of this year, I had the privilege to visit CERN, the European Organization for Nuclear Research. Located in Geneva, Switzerland, CERN is home to the largest machine in the world, the 27 kilometer diameter super collider known at the LHC or Large Hadron Collider. From my experiences during my two day visit, it became clear to me that CERN it is also a center for innovation in the realm of electrical and electronic interconnections both large and small. Read more...

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December 2008
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Global SMT & Packaging
 
Featured column

Vapour phase or convection for lead-free?
Bob Willis
A question to be debated during one of the author’s workshops at APEX Expo, Las Vegas in March. If you are a medium volume producer, want to solder tin/lead and lead-free with one process and like guaranteed reflow, the answer is simple.

Vapour phase soldering (VPS) has been around in the industry for many years and was one of the only two serious options during the early introduction of surface mount technology. In the early days, engineers had the option of brown belt for single-sided products, infrared and VPS. With the increasing availability of batch and inline VPS equipment, the market is likely to grow to 10% compared to the dominant position held by convection systems. The first reflow system used by this author was VPS, preferring the simplicity of the process and process set-up over the problems of accurate loading, board/belt positioning, profiling and over heating of paste causing flux residue charring. Read more...

 Products News

MYDATA announces MYTRACE – secure traceability software
This makes the software unique and gives the customer a safety and security without previous parallel.

Produce four PCBs side-by-side on a single machine with Siplace Quad Lane
The innovative four-lane conveyor from Siplace opens the door to totally new approaches in SMT manufacturing.

Staticide ESD Safety Shield is now available as an aerosol spray
The advanced formula dries clear and can adhere to a variety of surfaces including acrylic, polycarbonate, PETG, and glass.

More Products News...

 

Breaking News

3M and EV Group settle on patent infringement suit
3M and EV Group have agreed to settle the patent infringement litigation brought by EVG against 3M relating to systems for temporary wafer bonding.

Inovar expands capabilities with new x-ray fluorescence system
This system enables Inovar to perform quantitative analysis on solid, powder or paste-like materials to determine elemental composition and thickness.

Sono-Tek CEO ranked among the "Best CEOs" in the nation
Christopher Coccio, PhD., CEO of Sono-Tek Corporation, was named one of the Best CEOs in the Nation by DeMarche Associates, Inc., a leading investment research and financial consulting firm.

More Industry News...
 

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Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.

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