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Interview with Vinnie Mehta, executive director of MAIT, at the World Electronics Forum 2008.

WKK Distribution Ltd. signs license agreement with Nihon Superior Co. Ltd.

EFD opens new 116,000 square foot facility

STI moves into new upgraded facility

Nextreme announces new eTEG power generation evaluation kit

Creative Materials displays at Printed Electronics USA 2008
Global SMT & Packaging
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Vapour phase or convection for lead-free?
Bob Willis
A question to be debated during one of the author’s workshops at APEX Expo, Las Vegas in March. If you are a medium volume producer, want to solder tin/lead and lead-free with one process and like guaranteed reflow, the answer is simple.
Vapour phase soldering (VPS) has been around in the industry for many years and was one of the only two serious options during the early introduction of surface mount technology. In the early days, engineers had the option of brown belt for single-sided products, infrared and VPS. With the increasing availability of batch and inline VPS equipment, the market is likely to grow to 10% compared to the dominant position held by convection systems. The first reflow system used by this author was VPS, preferring the simplicity of the process and process set-up over the problems of accurate loading, board/belt positioning, profiling and over heating of paste causing flux residue charring. Read
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Issue 9.01
January 6, 2009
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