Thermally conductive liquid materials for electronics packaging
Sanjay Misra, Ph.D., The Bergquist Company

1-part and 2-part liquid adhesives and sealants have long been part of the materials portfolio used in electronics packaging. More recently, with thermal management needs, we have seen the advent of thermally conductive liquids as gap fillers and adhesives for providing a conductive pathway for heat. Thermally conductive liquids, while similar to their predecessors in many respects, also differ in some very significant ways. Read more...

Produce four PCBs side-by-side on a single machine with Siplace Quad Lane
The innovative four-lane conveyor from Siplace opens the door to totally new approaches in SMT manufacturing.

Staticide ESD Safety Shield is now available as an aerosol spray
The advanced formula dries clear and can adhere to a variety of surfaces including acrylic, polycarbonate, PETG, and glass.

CeTaQ drives quality and efficiency with placement force measurement
CeTaQ developed its innovative measuring device to exactly gauge even the most miniscule press-on force occurring during the automated component placement operation.

More Products News...

European sales of semiconductors declined
European sales of semiconductors declined by 13.9 percent in November to $3.17 billion compared to sales of $3.68 billion in November 2007.

Bliss Industries announces after-holidays special
Bliss Industries Inc., provider of handling carts and racks for electronics assembly, announces its first post-holidays special.

Valor acquires PCB Matrix
Valor Computerized Systems has acquired the assets of PCB Matrix Corporation, a leading provider of EDA library generation tools for both land pattern and schematic symbols.

P.D. Circuits announces 32 percent growth for 2008
Company president David Wolff attributed the company’s success to several factors: “First and foremost, P.D. Circuits has emphasized continued focus toward providing on-time quality boards for consumers,” he said.

Michael Whitehead establishes MEW Consulting to support legacy semiconductor equipment
The company’s range of technical expertise extends to automatic and manual wire/wedge bonders, ball bonders, die attach and saw platforms.

More Industry News...
 

Inside the January 2009 issue of
Global SMT & Packaging magazine:

• Electrostatic discharge (ESD) and automated handling processes
  Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD Competence Centre
• PCB layout and soldering nozzle design in selective soldering processes
  Reiner Zoch, SEHO Systems GmbH
• Supporting niche service needs at a regional level—a case study
  Barry Reece and Ken Russell, Clover Electronics
• Interview: Kyle Doyel—KYZEN Corporation
• Four industry suppliers come of age....
• Double-sided reflow in one reflow cycle
  Bob Willis
• 2009: Very little smooth sailing until at least summer
  Walt Custer and Jon Custer-Topai

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