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News
Debasish Choudhury interviews Om Wadha, CMD J V Electronics Pvt Ltd at the World Electronics Forum 2008.

News
STI to present at 2009 Pan Pacific Microelectronics Symposium

News
Indium Corporation’s Dr. Lee to Present at Pan Pacific Microelectronics Symposium

News
Nihon Superior's SN100C P800 power semiconductor lead-free solder paste

News
Siplace and Seho: dual-lane consistency from placement to reflow

News
Manncorp announces its own ‘economic stimulus package’


Global SMT & Packaging
E-mail: news@globalsmt.net
Website: www.globalsmt.net

Editorial Staff

Editor-in-Chief
Trevor Galbraith
Tel: +44 020 7871 7305 (EU)
Tel: +1 239 567 9736 (US)

Managing Editor
Heather Lackey
Tel: +1 (828) 231 9434

China Regional Editor
Lu Shuzhen
Tel: +86 (351) 652 3813

China Website/eNews Editor
Christine Zhang
Tel: +86 13311021565

India Regional Editor
Debasish Choudhury
Tel: +91 120 6453260

UK Regional Editor
Jade Po Kellard
Tel: +44 (0) 1202 388997

Circulation and Subscriptions
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Featured Article

Reflow significance on package on package (PoP) assembly
S. Manian Ramkumar, Ph.D. and Brian O’Leary

Package on package (PoP) is a rapidly evolving 3D packaging technique that meets the demand for lighter, faster and miniaturized electronics. PoP is the stacking of one peripheral array BGA package on another full, peripheral or custom array BGA package. One of the key concerns with PoP assembly is the final assembly yield, affected by package warpage. Read more.
 

The January 2009
issue is now online
Global SMT & Packaging

Click Here!
 
Featured Article

2008 World Distributor Review
The current global economic crisis has rippled across the world with alarming consequences. Not surprisingly, the crisis has had a huge effect on consumer confidence, and nowhere is this more evident than in China—factory to the world’s consumer goods. According to some sources, over 100,000 factories have closed, Foxconn have laid off over 77,000, and other tier 1 CEMs have laid off many thousands of workers.

2008 World Distributor Review

This year’s World Distributor Review is therefore an important snapshot of how the economic downturn is affecting the electronics industry. The picture is not the same in every territory. Some regions and some industry segments are still performing strongly. A collection of thoughts and opinions from the world’s leading electronics rep agencies and distributors offer a unique insight into what is happening on the ground. Read more...

 

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Case Study

NewsI am not buying a thermal profiler - I am buying prediction capabilities
Bill Pasco, process engineer at Garmin AT in Salem, Oregon USA, was convinced from his decade-long experience that a data acquisition profiler was a data acquisition profiler. The well-known brands all have similar accuracies, which are limited by the accuracy of the thermocouples used for profiling. What Bill was interested in, however, was identifying which prediction software (process optimization software) could quickly and accurately determine how to set up his oven for an in-spec profile. Read more...

 

 Products News

Asymtek fiducials-on-the-fly
Asymtek’s fiducials-on-the-fly technology locates fiducials on printed circuit boards five times faster than standard stop-and-capture method - increases customer completed parts per hour as much as 35 percent.

Bliss Industries provides a preview for its revolutionary FLEXconveyor
The FLEXconveyor is the first box-build factory on wheels, providing a new way to kit, box build products and assemble them.

Nihon Superior introduces NS-F850 flux for lead-free wave soldering
This eFlux for lead-free wave soldering provides excellent wetting and through-hole fill, and prevents solder balls from adhering to the solder mask.

More Products News...

 

Breaking News

FINE LINE STENCIL announces 99.1 percent on-time delivery for 2008
Quality suppliers of parts and tooling focused on on-time delivery are not a luxury but a necessity.

Ingo Bretthauer appointed CEO of LPKF Laser & Electronics AG
Bretthauer takes responsiblity of most areas previously managed by former CEO Bernd Hackmann, who left the company at the end of 2008.

Seven substances recommended for inclusion in the REACH authorization list
Once a substance is included in Annex XIV, it cannot be sold on the EU market 42 to 48 months after the inclusion date, unless it is authorized.

IPC APEX EXPOTM global business outlook keynote puts forecasting tools in industry’s hands
IPC APEX EXPO will take place at the Mandalay Bay Resort & Convention Center in Las Vegas, March 31-April 2, 2009.

More Industry News...
 

Global SMT & Packaging magazine

Inside the January 2009 issue of
Global SMT & Packaging magazine:

Global SMT & Packaging Magazine

  • Electrostatic discharge (ESD) and automated handling processes
    Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD Competence Centre
  • PCB layout and soldering nozzle design in selective soldering processes
    Reiner Zoch, SEHO Systems GmbH
  • Supporting niche service needs at a regional level—a case study
    Barry Reece and Ken Russell, Clover Electronics
  • Interview: Kyle Doyel—KYZEN Corporation
  • Four industry suppliers come of age....
  • Double-sided reflow in one reflow cycle
    Bob Willis
  • 2009: Very little smooth sailing until at least summer
    Walt Custer and Jon Custer-Topai

 

Do you have a technical solution for the industry?
Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.

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