|

Debasish Choudhury interviews Om Wadha, CMD J V Electronics Pvt Ltd at the World Electronics Forum 2008.

STI to present at 2009 Pan Pacific Microelectronics Symposium

Indium Corporation’s Dr. Lee to Present at Pan Pacific Microelectronics Symposium

Nihon Superior's SN100C P800 power semiconductor lead-free solder paste

Siplace and Seho: dual-lane consistency from placement to reflow

Manncorp announces its own ‘economic stimulus package’
Global SMT & Packaging
E-mail: news@globalsmt.net
Website: www.globalsmt.net
Editorial Staff
Circulation and Subscriptions
Tel: +44 (0)1458 832137
subscriptions
@globalsmt.net |
|
|
2008 World Distributor Review
The current global economic crisis has rippled across the world with alarming consequences. Not surprisingly, the crisis has had a huge effect on consumer confidence, and nowhere is this more evident than in China—factory to the world’s consumer goods. According to some sources, over 100,000 factories have closed, Foxconn have laid off over 77,000, and other tier 1 CEMs have laid off many thousands of workers.
This year’s World Distributor Review is therefore an important snapshot of how the economic downturn is affecting the electronics industry. The picture is not the same in every territory. Some regions and some industry segments are still performing strongly. A collection of thoughts and opinions from the world’s leading electronics rep agencies and distributors offer a unique insight into what is happening on the ground. Read
more...
|
I am not buying a thermal profiler - I am buying prediction capabilities
Bill Pasco, process engineer at Garmin AT in Salem, Oregon USA, was convinced from his decade-long experience that a data acquisition profiler was a data acquisition profiler. The well-known brands all have similar accuracies, which are limited by the accuracy of the thermocouples used for profiling. What Bill was interested in, however, was identifying which prediction software (process optimization software) could quickly and accurately determine how to set up his oven for an in-spec profile. Read
more...
|
|
|
|
|
| Global SMT & Packaging magazine |
Inside the January 2009 issue
of
Global SMT & Packaging magazine:
- Electrostatic discharge (ESD) and automated handling
processes
Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD
Competence Centre
- PCB layout and soldering nozzle design in selective
soldering processes
Reiner Zoch, SEHO Systems GmbH
- Supporting niche service needs at a regional level—a case
study
Barry Reece and Ken Russell, Clover Electronics
- Interview: Kyle Doyel—KYZEN Corporation
- Four industry suppliers come of age....
- Double-sided reflow in one reflow cycle
Bob Willis
- 2009: Very little smooth sailing until at least summer
Walt Custer and Jon Custer-Topai
|
| |
|
Issue 9.04
January 27, 2009
|