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YESTech wins additional AOI contract with MC Assembly
Dr. Harald Wack named president, ZESTRON Worldwide
Essemtec delivers first series of newly developed RO-VARIO reflow and curing ovens
BEST Inc EZReball™ reballing preforms for electronic packages down to 0.4mm pitch
Manncorp hot bar soldering systems bond unlikely materials
SemiProbe expands probe system with semiautomatic systems
Global SMT & Packaging
E-mail: news@globalsmt.net
Website: www.globalsmt.net
Editorial Staff
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Microelectronics assembly and packaging (MAP) workshop 2008 review
 The 8th International workshop on microelectronics assembly and packaging technologies was held in late November of last year and continues to be one of the best-kept open secrets of the IC packaging industry. The conference was the brainchild of Professor Hajime Tomokage of Fukuoka University. Professor Tomokage is one of the most charismatic individuals one is likely to meet in this industry and is the engine the drives the event. He is also a key person at the Asia Semiconductor Trading Support Association (ASTSA) and in that role has been successfully building bridges around the Pacific Rim to help encourage the exchange of technical ideas and concepts as well as market information and opportunities through various memoranda of understanding with other universities and associations in other countries in the region. Read
more...
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Carve-out completed successfully
Siemens Electronics Assembly Systems adjusts to market situation; wants to become faster and more flexible.
Dow Corning Electronics awards Krayden Inc. 'North American 2008 Distributor of the Year'
This is the third year (since program inception) that Krayden has earned GOLD level performance.
RPM Electronics going out of business
Chuck Mann, chief executive officer of RPM, and its parent company, RAD Electronics, said the corporation decided to shut down RPM because much of its business is being outsourced, primarily to China.
MEPTEC finalizes program for packaging symposium aimed at consumer applications
"Semiconductor Packaging - Impacting the Age of Consumer Electronics" will be held on Thursday, February 19, 2009 at the Wyndham Hotel, San Jose, CA.
Sono-Tek announces double-digit growth
Dr. Christopher L. Coccio, Chairman and CEO at Sono-tek, attributed the increase to the company’s recent business development program.
Page Electronics jets into the future with MYDATA
It is already helping the company to offer a faster and more flexible service to customers needing prototypes and special assemblies.
Technical experts to lead ‘Industry Chats’ at Virtual PCB
The chats are scheduled for 45 minutes each, allowing ample time for discussion between the panelists and attendees.
More
Industry News...
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| Global SMT & Packaging magazine |
Inside the January 2009 issue
of
Global SMT & Packaging magazine:
- Electrostatic discharge (ESD) and automated handling
processes
Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD
Competence Centre
- PCB layout and soldering nozzle design in selective
soldering processes
Reiner Zoch, SEHO Systems GmbH
- Supporting niche service needs at a regional level—a case
study
Barry Reece and Ken Russell, Clover Electronics
- Interview: Kyle Doyel—KYZEN Corporation
- Four industry suppliers come of age....
- Double-sided reflow in one reflow cycle
Bob Willis
- 2009: Very little smooth sailing until at least summer
Walt Custer and Jon Custer-Topai
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Issue 9.05
February 3, 2009
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