Interview - Kyle Doyel, Kyzen Corporation

Our last interview with Kyle Doyel was two years ago, when KYZEN was making its first steps into the Asian and European markets. Since then, the company has become firmly established in both markets, hiring local engineers and chemists and exporting the infamous KYZEN-friendly brand. Read more...

 

New Corrosion-Resistant Conductive Adhesive for Consumer Applications Delivers Cost-efficient Alternative to Current Technologies
by Bo Xia, Jayesh Shah and Wanda O’Hara, Henkel Corporation

For nearly two decades, flip chip technology has been widely used and accepted for several mainstream and high-end applications including flat panel displays and semiconductor modules in the form of chip (die) on glass (COG) and chip (die) on flex (COF). To facilitate the interconnect within these applications, anisotropic conductive films (ACFs) have generally been the preferred material for several reasons: ACF’s offer excellent low contact resistance and compatibility with noble metallization, they have outstanding adhesion to glass and offer highly reliable interconnection on fine resolution lines. But, the higher materials costs of ACFs combined with their multiple-step processing requirements and higher cure temperatures make them a less than ideal solution for some of today’s lower-cost consumer applications. Read more...

EnviroGuard™ 100% closed-loop stencil cleaner
EnviroGuard is the first and only aqueous stencil cleaner able to clean all types of solder paste with a 100% closed-loop process.

SIPLACE X-Series powered by SIPLACE CPP MultiStar
Siplace MultiStar is not only a new placement head – Siplace MultiStar raises the Siplace X-Series platform to a complete new level of performance and flexibility.

RMD Instruments to debut new feature for LeadTracer-RoHS system
The LTRSync+ software feature takes advantage of the LeadTracer’s superior K-shell x-rays to identify parts that might be substandard.

More Products News...

IPC survey shows reverse trend in regional sourcing in worldwide electronic interconnect industry
Forty-two percent of responding companies cited changes in their customers’ sourcing patterns from Asia back to North America or Europe in the past two years.

A slippery slope for contract manufacturers
Conditions in the global electronics contract manufacturing business are continuing to deteriorate due to the recession and the weakening high-tech industry.

Transitioning to Lead Free — Strategies for Implementation
Find new strategies for implementation at IPC and JEDEC’s conference on Transitioning to Lead Free — Strategies for Implementation, March 3-5, 2009 in Santa Clara, California.

Gary R. Sutcliffe promoted to manager, corporate technical services - Enthone Americas
Mr. Sutcliffe will have overall responsibility for the company's Corporate Technical Services Group and the Enthone Americas Plating Academy, both based in West Haven, CT.

BTU International adds new representative
Omni-tronics named to represent BTU International in Minnesota, North Dakota, South Dakota, Northern Wisconsin and Iowa

Kester celebrates 110 years in business
The company was founded in 1899 as the Chicago Solder Company to produce flux-cored solder wire.

More Industry News...
 

Inside the February 2009 issue of
Global SMT & Packaging magazine:

• "Strain gage testing: the delta effect of thermal cycle testing" by Mark T. McMeen
• "Resolution of solder voids in pin-in-hole product" by Condia Yu, Eddie W. W. Tang, Jack To, Ka Wai Chan, Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda, Sunil Nigam, Jeffrey Taylor & Kaspar Tsang
• "A new angle on printing" by George Babka and Scott Zerkle, Assembléon Americas; Frank Andres, Rahul Raut and Westin Bent, Cookson Electronics Assembly Materials; and Dave Connell, Research in Motion
• NBS turns over a new leaf: Michael Maslana interview
• Interview: Keith Bryant—SMART Group
• "IC packaging technology retrospective—
  part 1" by Joe Fjelstad
• "General guide to solder balls in wave soldering—now you see them, now you don’t" by Bob Willis
• "2009 & 2010: The coming global recovery" by Walt Custer and Jon Custer-Topai

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