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Juki promotes Todd O'Neil to sales manager, soldering products
Cookson launches new low-Ag Pb-free wave solder and rework alloy
Aqueous Technologies introduces E101 evaporator
Demonstration of JUKI’s FX-3 mounter leaves an impression in Russia
New module for angled-view inspection in Goepel AOI systems.
Small Part Vacuum Tweezer Kit handles parts as small as 200 µm
Global SMT & Packaging
E-mail: news@globalsmt.net
Website: www.globalsmt.net
Editorial Staff
Circulation and Subscriptions
Tel: +44 (0)1458 832137
subscriptions
@globalsmt.net |
| Strategies for the economic downturn
Trevor Galbraith
For business owners and those who are responsible for guiding their companies through this period, it is a time for tightening cashflows, strategic ingenuity and strong hearts. Of course, the first reaction is to scrutinize all discretionary expenditure and decide where you can trim costs in order to maintain a steady ship. Read more.
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The February 2009
issue is now online
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PCB layout and soldering nozzle design in selective soldering processes
Reiner Zoch
The ability to reduce production costs while maintaining a consistent high quality is essential. Densely populated multilayer boards and miniaturized, high-pin-count, fine-pitch devices cannot be efficiently repaired with high quality. Manual repair soldering processes can cause enormous thermal problems with lead-free applications. ‘Hidden costs,’ such as productivity rates, operator training and damaged assembly costs, have to be taken into consideration as well—the target, therefore, is a zero-fault selective soldering process. Read more.
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Attend Global SMT's panel at Virtual PCB
Global SMT & Packaging editor-in-chief Trevor Galbraith will be moderating a panel on cleaning at the Virtual PCB show this week. Panelists for "Cleaning—Chemistry vs. Mechanical Impingement" will be Dr. Mike Bixenman, Kyzen Corporation; Harold Wack, Zestron; Mike Konrad, Aqueous Technologies; and Steve Stach, Austin-American Technology. The panel takes place Wednesday, February 25th at 1:00pm. Visit Virtual PCB to learn more about attending this online expo & conference.
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| Global SMT & Packaging magazine |
Inside the February 2009 issue
of
Global SMT & Packaging magazine:
- "Strain gage testing: the delta effect of thermal cycle testing" by Mark T. McMeen
- "Resolution of solder voids in pin-in-hole product" by
Condia Yu, Eddie W. W. Tang, Jack To, Ka Wai Chan, Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie
Kobeda, Sunil Nigam, Jeffrey Taylor & Kaspar Tsang
- "A new angle on printing" by
George Babka and Scott Zerkle, Assembléon Americas; Frank Andres,
Rahul Raut and Westin Bent, Cookson Electronics Assembly
Materials; and Dave Connell, Research in Motion
- NBS turns over a new leaf: Michael Maslana interview
- Interview: Keith Bryant—SMART Group
- "IC packaging technology retrospective—
part 1" by
Joe Fjelstad
- "General guide to solder balls in wave
soldering—now you see them, now you
don’t" by
Bob Willis
- "2009 & 2010: The coming global recovery" by
Walt Custer and Jon Custer-Topai
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Issue 9.08
February 25, 2009
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