A new angle on printing
George Babka, Scott Zerkle, Frank Andres, Rahul Raut, Westin Bent and Dave Connell

Although blade contact angle is a critical stencil printing parameter, screen printers have so far been unable to vary it ‘on-the-fly’, in software. The recently released Assembléon/Yamaha YGP printer has changed this, and has made new application research possible to study a crucial 01005 process variable for feature printing that previous researchers have ignored. Read more.

Convection oven RO300FC also suitable for solder at aluminium cores
The vertical hot-air flow reaches every place at the printing board.

Siplace Precedence Finder optimizes placement sequence
Effective collision protection for the placement process.

Glenbrook Technologies introduces programmable positioning
Now available as an option and an upgrade to select models of Glenbrook x-ray inspection systems.

New longer support module for VacuNest
VacuNest offers a unique maintenance free tooling support for printers, dispensers and pick & place systems.

Economical electrically conductive silver ink available from Creative Materials
Applications include, but are not limited to, RFID antennas, EMI/RFI shielding, polymer thick film circuitry and membrane switches.

More Products News...

Francisco dumps Universal Instruments
Industry sources have confirmed today that Universal Instruments has been acquired last week by Patriot Capital Partners.

China’s automotive electronics suppliers face slowdown
Due to the international economic recession in 2008 and into 2009, the global automotive electronics industry will not rebound until after 2010.

Multinational companies strengthening commitment to China despite economic challenges
Anew AmCham Shanghai/Booz & Company study finds that while reporting increases in manufacturing costs and declining sales, many companies see continued opportunities in China.

IPC to deliver PCB tutorial at SMT Nürnberg 2009
European representative Lars Wallin explain how IPC standards can be used to eliminate unnecessary and costly mistakes in printed board manufacturing.

YESTech moves operations to expanded facility in Carlsbad, California
The new location will provide extended sales, training and technical support to YESTech's growing customer base.

More Industry News...
 

Inside the February 2009 issue of
Global SMT & Packaging magazine:

• "Strain gage testing: the delta effect of thermal cycle testing" by Mark T. McMeen
• "Resolution of solder voids in pin-in-hole product" by Condia Yu, Eddie W. W. Tang, Jack To, Ka Wai Chan, Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda, Sunil Nigam, Jeffrey Taylor & Kaspar Tsang
• "A new angle on printing" by George Babka and Scott Zerkle, Assembléon Americas; Frank Andres, Rahul Raut and Westin Bent, Cookson Electronics Assembly Materials; and Dave Connell, Research in Motion
• NBS turns over a new leaf: Michael Maslana interview
• Interview: Keith Bryant—SMART Group
• "IC packaging technology retrospective—
  part 1" by Joe Fjelstad
• "General guide to solder balls in wave soldering—now you see them, now you don’t" by Bob Willis
• "2009 & 2010: The coming global recovery" by Walt Custer and Jon Custer-Topai

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