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MIRTEC expands North America sales & service division
Enthone appoint Pat Creque sales manager, US eastern region
Kester's Peter Biocca to present at APEX technical conference
Cincinnati Sub-Zero (CSZ) intros new line of vertical thermal shock chambers
Nihon Superior intros Pb-free paste for 0402 metric chip components
Essemtec CDS6200 features two jet dispenser systems
Henkel's business results reflect National Starch acquisition and Ecolab sale
Global SMT & Packaging
E-mail: news@globalsmt.net
Website: www.globalsmt.net
Editorial Staff
Circulation and Subscriptions
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General guide to solder balls in wave soldering—now you see them, now you don’t
Bob Willis
There are two types of solder balls generally seen after wave soldering. They can be referred to as consistent/repeating or random balls. Obviously there are lots of theories on how they form and attach/bond to the surface of the solder mask.
Now you seen them, now you don’t. If you have ever tried microsectioning solder balls on a solder mask surface you will know how difficult it is. Losing your balls can be a big problem to some!!! Read more.
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Universal restructures debt, changes the makeup of its board of directors
The privately held company paid down about half of its debt and obtained better credit terms from its lenders.
MIRTEC receives 2009 Frost & Sullivan Award for Product Innovation in the AOI Equipment Market
The award was presented for demonstrating excellence in new product development, having a competitive advantage over existing products in the market, and successfully executing a sound sales and marketing strategy.
Smart phone market expected to grow
iSupply predicts global unit growth as high as 11.1 percent in 2009.
Digi-Key Corporation and BlueRadios sign distirbution agreement
Slated to appear in future print and online catalogs, BlueRadios' products are now available on Digi-Key’s US and Canadian websites.
KIC experts offer profiling advice at APEX 2009
If KIC’s engineering experts cannot answer a profiling question during the APEX exhibition, that person will receive a free copy of the 2009 Profiling Guide (a $24.00 value).
Orpro Vision signs an agreement for the acquisition of Orbotech’s Assembly business
Orpro Vision will take over the European and American assembly business from Orbotech: R&D, technical support, sales, manufacturing and process control solutions.
New JUKI distributor for the Hungarian market
Danutek has a demonstration centre in Hungary, and locally placed engineers in Hungary, Czech & Slovak Republics, Poland, Romania, Bulgaria, and Ukraine.
More
Industry News...
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| Global SMT & Packaging magazine |
Inside the March 2009 issue
of
Global SMT & Packaging magazine:
- "iNEMI project evaluates BFR-free PCB materials" by
Stephen Tisdale, Gary B. Long, Roger Krabbenhoft, Kostas Papathomas, Ph.D., and Terry Fischer
- "PoP: An EMS perspective on assembly, rework and reliability" by
Heather McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell and Roden Cortero
- "Efficient line changeover: the key to lean manufacturing" by
Douglas Farlow
- Interview: Bob Black—JUKI
- New Product Focus: Breaking old placement head paradigms
- "PiP, PoP and Pup—Package with package construction options" (Americas edition)
Joe Fjelstad
- "Counterfeit component introduction & testing" (European edition)
Bob Willis
- "When? Reaching the elusive ‘bottom’ and beginning recovery"
Walt Custer and Jon Custer-Topai
- APEX preview: The Vendor Forum
- APEX technology preview: What’s on the show floor?
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Issue 9.11
March 10, 2009
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