GLOBAL Technology Awards

Discussion panels

The Counterfeit Components Debate How big is the problem? What is the cost to manufactures? What can be done to combat it? Moderated by Global SMT & Packaging magazine’s Trevor Galbraith.		Counterfeit Debate Panelists Keith Bryant, Dage Jens Peter Steffan, Yxlon Mathieu Bini, ABI Electronics
The Cleaning Debate As microelectronics become smaller, the need for cleaning increases. The panel will discuss this and some of the key drivers on the need to clean. The panel will also discuss the implications of REACH and whether it is a barrier to foreign businesses entering Europe or is it essential legislation to protect the environment and EU consumers. Moderated by Global SMT & Packaging magazine’s Trevor Galbraith.		Cleaning Debate Panelists Tom Forsythe, Kyzen Corp Mike Konrad, Aqueous Technologies Vladimir Sitko, PBT Ralph Hoeckle, ZESTRON
The Pick & Place Debate The already crowded placement machine market has become even more congested since the high-volume manufacturers moved into the mid-volume space. This panel will discuss the key technical differentiators that are changing the pick and place environment and what operators should be looking for in their next generation equipment. Moderated by Global SMT & Packaging magazine’s Trevor Galbraith.		PICK & PLACE Debate Panelists Günter Schindler, Siemens Tom Cornelissen, Assembléon Robert Göthner, MYDATA Bob Black, Juki

Show Report: Productronica confirms industry rebound
by Trevor Galbraith

Even in a recessionary year, nobody who has ever visited the hallowed halls of Productronica would disagree that it is the most intense and exhausting event in the calendar. Despite the 30% drop in visitors from 40,000 to 28,000, Productronica produced the expected raft of new product introductions and, surprisingly, a large number of machine sales on the floor.

Exhibitors were also astounded at the strength of machine sales. Some companies raked up double-digit numbers, confirming the fact that confidence is returning to the manufacturing market. Without doubt, some of these sales were the result of companies who had been withholding purchases earlier in the year, spending the money before their budgets expired, but the result brought a heady mood of optimism to those who had also taken the risk and extended their budgets to exhibit in Munich.

Another surprise this week was the size of the audiences tuning into the live debates and Global Technology Awards. Global SMT TV registered over 12,300 viewing minutes during the course of the show, vindicating the huge effort that goes into providing a comprehensive, technically informative video program.

Business news

The major business announcement this week came from Finetech, the high-precision rework company, who acquired the assets of Martin GmbH.

Kyzen Corporation proudly announced their new production facility in Penang, Malaysia. The new, state-of-the-art facility is equipped with a full laboratory and training facilities.

Assembléon and Siemens both went head-to-head with a ‘Capacity on Demand’ concept. Essentially, customers can purchase a basic placement system and rent additional gantries and heads to meet peak demand times. Assembléon claims this can save operators up to 20% in capital equipment costs.

Siemens also promoted their new build-to-order concept, which they claim, coupled with ‘Capacity-on-Demand in their SX series, offers customers the ultimate flexibility and capital cost saving.

New products

Some of the major new innovations at the show are listed below:

Essemtec moved deeper into the mid-range market with the launch of the Paraquda pick and place machine early on Tuesday morning. This system is a complete redesign from their former platforms. The double H drive servo system can accommodate two gantries with each head rated at 10,000 cph. The Paraquda holds up to 240 8-mm feeders and has a maximum board size of 470 x 600 mm. The Paraquda is fitted with new, faster intelligent feeders and is backwards compatible with existing FLX feeders. (video)

Creating more of a stir than the pick and place system was the ePlace software, based on Essemtec’s new EEZ technology platform. This new GUI software is extremely easy to use, provides real-time display and context sensitive help among many other features.

GE Sensing & Inspection Technologies presented its phoenix|x-ray x|act technology for simple and intuitive CAD-based µAXI with very high image magnification (±1 µm) using a microfocus 180 kv open tube. Inspection programs can be completed in less than two minutes, and the software can compare against IPC 610-A Standards or thresholds set by the user. Another highlight at the GE stand was the new, temperature-stabilised DXR digital detector on the phoenix nanome|x. At up to 30 fps (frames per second), it offers low noise coupled with brilliant image quality.

Assembléon introduced their new MCP printer. Using technology from the motor-cycle industry, the print head can deliver homogenous pressure across the stencil in a 6 second cycle time (plus print). The MCP measure the print roll as it moves across the stencil and compensates by adding more paste when required. The servo driven squeegee blade can be adjusted in one degree increments between 45 and 60 degrees. The specially coated blades offer > 100,000 print cycles. The printer has 2 1/2D inspection capabilities, under-screen cleaner and a vacuum system that keeps the stencil in place to offer repeatability of ±5 µm and accuracy of ±25 µm at 3 sigma.

Asymtek launched three new products at the show. The SC400 VCS is a viscosity control system that tightly controls the viscosity and dot size by keeping the fluid at a constant temperature. The minimum dot size is around 2-3 mm diameter.

The SL940 dispense valve is a tilt and rotate device that can access almost all areas on the board. The Spectrum 920 is a dual simultaneous jetting system that provides a 50% speed increase while precisely controlling the fluid delivery by monitoring the viscosity in both jets. A second lane can be added to this machine for enhanced throughput.

The Dispensmate D 583 is a dispense and cure system for laboratory applications. It has a 325 x 325 mm platform and can use any dispensing valve in the Asymtek range. The Dispensmate also uses the same software platform as the larger production machines

Data I/O introduced two products containing their new Flashcore III programming architecture. The PS588 can program five million devices per year or more at a speed of up to 10 Mbit per second (if the device supports it). The PS588 can handle up to 48 devices per cycle and supports DIP, PLCC, SOIC, SON, WSON, SSOP, CSP (µBGA, BGA) QFP, TQFP & TSOP.

The FLX500™ is an automated programmer that reduces the risk and damage associated with manual programming. The benefits of the FLX500 include the fastest changeover times, self-learning plug-and-play operation, language independent graphical user interface, memory and microcontroller support, a flexible and modular design, outstanding quality, a self contained pneumatic system with minimal noise and requiring no special air facilities, reduced scrap costs and ease of use.

Under the jumping water spouts on the Kyzen booth, the company promoted their Aquanox 4241 cleaner for use in batch cleaners or stencil cleaners. They also presented their new ph-neutral chemistry, Aquanox 4703. (video)

BPM Microsystems launched their new BP Win 4.54 software. The GUI user interface is language independent and programs 1,100 devices per hour using a Cyberoptics alignment system. The software provides full SPC and yield statistics and minimizes and manages bit flips.

MIRTEC introduced a new SPI system. The MS-11 uses a dual probe moiré technology that illuminates both sides of the solder joints and provides a more accurate reading. The MS-11 is built on the same platform as the MIRTEC MV-7 and can inspect at a rate of 40cm² per second with a 2 µm height resolution. Other news on the MIRTEC stand was a new laser scan technology that can be added to the MV-7xi AOI system. The MV-3L desktop has also been upgraded to 5-megapixel cameras and laser beam, single point inspection, offering higher defect detection and lower false calls. (video)

Cyberoptics introduced a software upgrade to their SE500 SPI system. The new software reduces programming by up to 40%. The SE500 can handle board sizes up to 410 x 410 mm and can measure components smaller than 01005. The newer SE500x can handle board sizes up to 810 x 610 mm.

Europlacer launched the XPii pick and place machine. Fitted with linear motors and up to 92 8-mm feeders, the XPii is built on a modular concept and can be configured with one or two gantries and eight or 12 nozzles per head to give a run rate of 28,000 cph. The XPii can handle components from 01005 to 50 x 50 mm and board sizes up to 508 x 460 mm. The launch was also complemented by a new software release. The RC5.15 has a wizard that can create new programs very quickly. It is backwards compatible and can control multiple machines to assist line balancing. The software is also equipped with a job optimizer. Finally, the feeder systems have been updated with a data matrix barcode to enable full feeder intelligence. The new feeders use a shorter tape element.

Speedprint’s SP700avi has now been modified to accommodate board sizes up to 510 x 610 mm. It is also fitted with a modular conveyor that can move the board from a clamp to a snugging solution to handle warped boards. The software program can now offer offline programming and can detect effects such as PCB stretch as well as the standard range of defects. If there happens to be any dead time on the line, the Speedprint 2D inspection system will continue to inspect further regions of interest on the board making full use of any available inspection time, without slowing down the line.

Aqueous Technologies was one of the few companies who avoided the recession and experienced 30% growth. President and CEO Mike Konrad blames the continued growth of lead-free, smaller geometries and residues left on the board for the increasing demand. Aqueous Technologies launched their new, redesigned Zero Ion cleanliness tester, the Zero Ion G3. The redesigned chamber is more user-friendly, and the software measures cleanliness against all standards and provides comprehensive SPC data correlated to bar codes on the boards. The redesigned tester is 60% less expensive than its predecessor. (video)

Practical Components are always at the forefront of new dummy components through their close relationship with AMKOR. The latest dummies are from the AMKOR Fusion range of QFPs and QFAs. Practical also introduced a new thermal cycle test board and a drop test board. Their B52 cleaning test board offers SIR testing of components, isolating leads with no crosstalk.

JUKI announced the impending arrival of the KE3020 RL in mid-2010. The spindle heads on the KE3020 RL will be faster, quieter and use less energy, while achieving 17,100 cph. It will handle component ranges from 01005 to 74 x 74 or 50 x 150mm. The KE3020 RL can handle extra large boards up to 610 x 510mm and has a feeder capacity of 80 x 8mm electric feeders. Depending on the model, the KE3020 RL can place components of up to 25mm in height.

The system utilises a multi-nozzle laser head (6 nozzles) with the placement accuracy of ±30 µm supplied exclusively for Juki from CyberOptics. (video)

Finetech exhibited a new, clean-look, modular concept to their Fineplacer Matrix ma placement system and Matrix rs semi-automatic rework system. The Matrix rs has interchangeable process heads. Thermosonic bonding for low temperature applications and Thermo compression for high temperature applications. FineTech also introduced a new entry-level rework system priced at under €25k.

Production Solutions introduced a new high density board support system for HD boards with fewer changeovers. The RED-E-SET HD system is 4" x 8" and the auto set software can be integrated into most machine software platforms. The RED-E-SET HD has a 24" long bar model for placing in enclosed spaces within placement or printing machines.

Valor introduced the Dynamix platform, a fully integrated MES system that users can add Valor’s V-Plan, V-Manage or V-Check modules to. The software enables better decision making processes for scheduling and planning by timing three boards against a theoretical level, then balancing and optimizing the line. Dynamix will act as the bedrock of the Valor EMS software suite and with the forthcoming launch of Scheduler, expected in 2010, will be able to offer full line balancing across the factory environment. Valor seem to be en route to becoming a must-have software platform for companies to be able to maximize their equipment utilization and control their materials inventory. In the near future, EMS companies will be unable to compete without it. One of the hidden values of this software is the ability to predict the life expectancy of motors, belts and drives and alert operators to order new parts before the machine breaks down and stops the line. (video)

SEHO launched the MaxiWave 2340C, a modular wave soldering machine that can incorporate up to three lanes. The length of the machine varies from 2.4-3.3 metres depending on the configuration. The preheat is performed by infrared, convection or quartz. The machine has a twin-wave laminar flow that can offer SnPB or Pb-free. Bath exchange is performed at the rear of the machine and changeover can be performed in 30 minutes. (video)

SEHO also released a selective rework station for high mass components. The PowerRepair has a modular concept and the entire cycle is controlled by one controller from entry to control of the drop-jet fluxer. Each board creates a record showing the areas on the board successfully fluxed. A new offline programming system uses a Google™ style interface.The SEHO PowerRepair has a cooled table that has a mini wave in the centre. A foot pedal operates a glass door that slides back and allows the mini wave to rise up and solder the board or areas of the board needing reworked. An alarm alerts the operator when the board should be removed. The PowerRepair has a hot air option that can be used to clean holes, etc.

SEHO’s D-Prep software scans an image of the board and corrects any deformations (e.g. warped boards) to align the board for soldering. The program creates the optimum route and can even make the nozzle jump over large components in an automatic or manual program mode.

Balver Zinn announced a range of new products. Aquasol is a new water-soluble flux that works with all alloys and is aimed at the US market. It is currently in beta testing and will be available in 6-8 weeks. The 3960RX is a VOC free flux and the 396DRX-M is more active version for low residues and good for pin tests. BZ offer SN100C for high temperature pin-in-paste applications and have developed an SnBi formulation for low temperature pin-in-paste applications. Finally, the Brilliant 211 product is a new cored solder wire offering excellent wetability, spread and flow. (video)

KIC are focusing on energy and cost savings, optimizing the oven to use the least amount of energy to achieve optimum reflow results. Recent tests with Delta in the Czech Republic have achieved savings in electricity costs of 15%. KIC are expecting to launch a new inline profiler for vapor phase in the near future. (video)

Marantz came up with a novel new concept for SPI. The PowerSpector SI 5D based on a combination of traditional 2D and 3D inspection. The company claims that 3D cannot detect below the 50 µm level and that by using 2D to cover this area, they can provide a more comprehensive view of solder joints than separate 2D or 3D systems. The system inspects 80 cm² per second using a Windows™ 64 bit processor. The 3D inspection uses laser triangulation, while 2D uses RGB and a central sensor uses topographical 3D as a reference. The system will be available in Asia in Q1 and Europe in Spring 2010.

DEK showcased the Sentinel board verification system. The system checks barcodes, verifies squeegee height and angle, checks the cleaning papers and measures the paste roll. If more paste is needed, it is automatically added. The Sentinel also performs 100% 2D inspection at line beat rates using eight 5-megapixel cameras.

OK International presented upgrades to their workhorse APR5000XL. It now offers two heating zones to localize the heat. OKI’s future development strategy will be convection based. (video)

EMS manufacturing

Fabrinet are one of the larger contract manufacturers, claiming 30% market share in the optical communications sector. The handle everything from DFM through production, final box build and logistics, based from a trade free zone in Thailand. Fabrinet has 18 lines and bring a lot of the manufacturing expertise from their former experience in the disk drive industry. President and CEO, Tom Mitchell formerly worked for Seagate.

Elcoteq announced plans to diversify out of the communications sector into consumer electronics and system solutions. The Pecs-based CEM feels that it has a range of competencies that could be extended into these sectors without diluting their telecommunications expertise.

And so, this brings to an end another Productronica roundup. Productronica is still the world’s leading trade show, but its wings were slightly clipped. The notable lack of Asian faces gave many the impression that the show was becoming much more European centric. However, many Asian visitors and some from other non EU countries had difficulty obtaining visa from the German embassy. If Germany is going to remain the trade fair capital of the world, it had better address this problem, and quickly.

On the show floor....