News from the SMT & advanced packaging industry for May 22, 2012 brought to you by Global SMT & Packaging
www.globalsmt.net

== Breaking News ==


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== Technology News ==


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MIRTEC: Expect more
MV-3 desktop AOI series / MV-7 inline AOI series
www.mirtecusa.com
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== Events News ==


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Reduce your reflow oven electricity use - instantly!
KIC's "Power" software optimizes oven setup for reduced electricity use while positioning your process deep in spec. Reduce cost - increase profits! www.globalsmt.net/kicad.html
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== Latest Tweets ==

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Yes, you can afford Valor. Call us. 949-586-5969
www.valor.com
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== Global SMT Magazine ==

Issue 9.12 - December 2009

Investigation and development of tin-lead and lead-free solder pastes to reduce head-in-pillow defects

Combating counterfeit components—industry initiatives for a global problem

Creating flexible circuit assemblies without solder (Americas edition)

Measuring package on package—possible procedure, comments welcome

Read it: http://www.globalsmt.net/subscribe/pre-subscription_form.php

Global SMT & Packaging, Trafalgar Publications Ltd, 8 Talbot Hill Road, Bournemouth, Dorset BH9 2JT, UK

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