VOLUME 8 NUMBER 11 NOVEMBER 2008
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  Global SMT & Packaging Magazine 8.10
 
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Electronic India 2008
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Hon Hai Foxconn Sales Up in October
clip2 STI Electronics Recognized by Inc. Magazine
clip3 Asymtek Introduces Dispense Jet DJ-100
   
 
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FEATURE ARTICLE
 


01005 assembly process - from the board design to reflow

by Norbert Heilmann

Indium CW-501

The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable and cost-effective solutions. 01005 components challenge all processes in the assembly sequence because of their size: 0.2 mm by 0.4 mm. They are almost invisible, at least for the naked eye, and extremely light weight (0.04 mg). Read More

 
 
 
FEATURE INTERVIEW
 
A Maestro - Dr. Hayao Nakahara interview


Neil MacRaid

"Think Big," Dr. Nakahara told a gathering of Indian PCB makers at Bangalore.

Dr. Hayao Nakahara, the world renowned consultant for the PCB industry, was in Bangalore earlier this month to fulfill his commitment to a PCB company near Bangalore. IPCA seized this opportunity to hoste a Dinner in honour of Dr. Nakahara, and invited all its members to attend a presentation on "World PCB Markets and Technology Trends" at Hotel Royal Orchid Central, Bangalore on November 8, 2008.

Dr. Nakahara is industry's foremost expert on the Asian PCB industry. He is the president of N.T. Information Ltd (Huntington, NY) - a consulting company dedicated to the PCB Industry, and also member of IPC Technology Market Research Council for World PWB output. Read the full interview.

 
 
 
FEATURE COLUMNIST
 


Hot air solder levelling - is it a HASL?

Bob Willis

I have said it many times in articles and seminars, Nothing Solders Like Solder, but design and manufacturing engineers need to understand all the different process options available. There are advantage and disadvantages to any process, and process and material improvements have seen wise companies revisit HASL with lead-free to overcome some of the other problems with lead-free assembly. Read more.

 
 
 
Connect with the 'new' in the electronics industry
 


India - The Economic Bellwether

COMPONEX NEPCON 2009by Debasish P. Choudhury

India has been one of the best performers in the world economy in recent times, but rapidly rising inflation and the complexities of running the world's biggest democracy are proving challenging.

Recent growth trends in Indian economy
The Indian economy grew 9.2% in 2007 and 9.6% in 2006, emerging as the second fastest growing major economy in the world. Growth had been supported by markets reforms, huge inflows of FDI, rising foreign exchange reserves, both an IT and real estate boom, and a flourishing capital market. Read the full article

 
 
 
NEW PRODUCTS
 


Essemtec's semiautomatic SMT prototyping system

Small batches and prototypes of SMD assembled boards can be mounted quickly and accurately using the Essemtec pick-and-place system - EXPERT-SAFP.
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Aurotek appoints iNETest to support Factory Automation business in India

iNETest Technologies is the official distributor for Aurotek γ-S168 series PCB separator in India.
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Essemtec premier's new Pick-and-Place system for 3D-MID

Indium CW-501

Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products.

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Asymtek introduces the new DispenseJet DJ-100 Jet

Combines high production speed with exceptional accuracy and process control for electronics manufacturers. .....................................................................................................................

GOEPEL electronic steps into the highest performance class with brand-new X-Ray Inspection System
Thursday, 13 November 2008

At this year electronica trade show, GOEPEL electronics introduces OptiCon X-Line 3D, a brand-new in-line 3D X-ray inspection system with excellent system features.
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Seika Machinery, Inc. premiers 3-D high precision laser in-line inspection system

Indium CW-501

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces Anritsu, a new 3-D High Precision Laser In-Line Inspection System.




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New Metcal MX-5000 systems increase production throughput and assure precision control

Indium CW-501

OK International has launched the new Metcal MX-5000 Series Soldering and Rework System. Combining increased power and an enhanced hand-piece with unique energy and tip-saving features



.... more product news

 
 
 
BREAKING NEWS
 


Semiconductor industry group predicts chip slump in 2009

The Semiconductor Industry Association (SIA) believes worldwide semiconductor sales will fall from an estimated $261.2 billion in 2008 to $246.7 billion in 2009, or some 5.6 percent.
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Electronics industry pins great hopes on "green electronics"

With a constantly high number of exhibitors and visitors, electronica 2008 sent out some positive signals to the international electronics industry.
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BEL to celebrate ground breaking of its new unit at Kerala

Bharat Electronics Limited (BEL) is planning to set up a unit at Kinfra Hi-Tech Industrial Park, Kalamassery, Kochi.
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AT&S to relocate machines from Leoben-Hinterberg facility to India; reduce investment by EUR 7.4 mil

The effects of recent developments in the world's financial markets on the real economy are increasingly now also being felt in the electronics industry. Therefore, AT&S is to adapt capacities at the facility in Leoben-Hinterberg, Austria as well as the implementation of a impairment writedown at AT&S Korea.
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Orbotech faces Q3 2008 losses, plans to exit Assembly PCB business

Commencing in the third quarter of 2008, the company began scaling back its activities in the assembled PCB business, but will continue to service its installed base of products.
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Wipro explores expansion plans in Uttarakhand

Despite the current financial meltdown, information technology major Wipro is looking for further expansion in Uttarakhand.
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Record sales for Foxconn and its subsidiary in October

Despite a weakening global economy, Foxconn Electronics (Hon Hai Precision Industry) and company subsidiary Foxconn Technology reported October sales that beat market expectations and hit respective company records.
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Delphi begins construction of new electronics manufacturing facility in Chennai

Delphi will be investing close to Rs. 250 crores in the new Chennai plant which is planned to be built in three phases and is expected to be operational toward the end of 2009.
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Electronics contract manufacturing business to stay afloat during recession

The global electronics contract manufacturing business will not escape the impact of the current economic downturn
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Balver Zinn appoints Holders Technology to support PCB fabrication business in India

Indium CW-501

Balver Zinn, a leading provider of high-quality solders in various alloys, anodes, solder wire, fluxes and pastes, announces the appointment of Holders Technology as distributor for its PCB Fabrication business in India.


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Sanmina-SCI promotes Hari Pillai to President and Chief Operating Officer

Sanmina-SCI has promoted Hari Pillai to President and Chief Operating Officer. Mr. Pillai has held various senior management positions during his 14 year career at Sanmina-SCI

.... more breaking news

 
 
 
ASSOCIATION NEWS



ISA Vision Summit 2009

India Semiconductor Association is organizing its Vision Summit 2009 at Hotel Leela Palace, Bangalore during Feb.16-17, 2009. This year's theme is "India: Gateway to Future Markets - Unleashing Opportunities."
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Mission 5X5: Transform India into Global ICTE manufacturing hub

Confederation of Indian Industry has launched Mission 5X5, an initiative to lead India into becoming the 5th largest ICTE Manufacturing hub in the world. India has the capability to join the ranks of the leading nations in ICTE manufacturing - U.S., China, Japan, Germany, Taiwan and South Korea.

 
 
 
Do you have a technical solution for the industry?
Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
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