VOLUME 9 NUMBER 2 FEBRUARY 2009
Global SMT logo
 
US/Eu Edition China Edition Korea Edition
 
  Industry video newscasts, every week  
 
Click Here! Click Here!
  SHOW CENTRAL

SHOW PREVIEW

New Delhi awaits its biggest and longest running electronic trade show - COMPONEX NEPCON India 2009

ELCINA Pavilion at COMPONEX NEPCON India 2009
International Conference (Feb. 24-25): "Growth Opportunities in Electronics Manufacturing - The Road Ahead"
National Conference on E-Waste (Feb. 26) & Release of Report on E-Waste Management in India
  VIDEO NEWSCAST view more video

Connect with the 'NEW' in the electronics industry - Componex Nepcon India 2009

COMPONEX NEPCON 2009
 
  PRODUCT PREVIEWS
American Tec to display FUJI NXT-II, FUJI XPF and MINAMI MARK-II at Componex Nepcon India 2009
Bergen Associates presents ERSA, LPKF, Posalux, Schmoll & PARMI products at Componex Nepcon India 09
Bergen Systems to showcase a range of new products at Componex Nepcon India 2009
BPM distributor iNETest to display 2710 Programmer at Componex Nepcon India 2009
DEK delivers more choice and value at COMPONEX NEPCON India 2009
Electrolube exhibits at Componex Nepcon India 2009
Essemtec exhibits SP150 printer, Pantera XV and RO300FC-C at Componex Nepcon India 2009
STI Electronics features LUXO'S New 23 mm microscopes
Essemtec begins 2009 with a new entry-level Pick-and-Place system
Geyer Electronic to display crystals and oscillators at Componex Nepcon India 2009
KIC to feature KIC Explorer RF and KIC RPI at Componex Nepcon India 2009
Maxim SMT to display cutting edge SMT products at Componex Nepcon India 2009
Mrideep to showcase products of two prime principals at Componex Nepcon India 2009
NMtronics presents an array of machines at Componex Nepcon India 2009
OK International to display innovative assembly technologies at Componex Nepcon India 2009
  Panasonic exhibits at Componex Nepcon India 2009
Seica SpA to exhibit their latest test and production solutions at Componex Nepcon India 2009
Sono-Tek to feature SonoFlux EZ at Componex Nepcon India 2009

TransTec presents Yamaha & Asymtek machines at Componex Nepcon India 2009
   
 
Circulation and Subscriptions
Tel: +44 (0)1458 832137
subscriptions@globalsmt.net


For editorial contacts,
please visit www.globalsmt.net

Advertising Contacts - US
Lino D'Andreti
VP Sales - Americas
Tel: +1 (603) 580-5549
ldandreti@globalsmt.net

Website and Newsletter Sales
Sandy Daneau
Tel: +1 603 686-6288
sdaneau@globalsmt.net


Advertising Contacts - Asia
Debasish Choudhury
Asia/Pacific Sales Manager
Tel: +91 120 6453260
dchoudhury@globalsmt.net


Advertising Contacts - Europe
Andy Kellard
International Sales Director
Tel: +44 (1202) 388997
Mobile: +44 (0)7766 951665
akellard@globalsmt.net


Forward this newsletter to a colleague

Global SMT & Packaging - India
email: dchoudhury@globalsmtindia.in
phone: +91 120 6453260
web: http://www.globalsmtindia.in

Global SMT & Packaging India
Flat No. 237-C, Express View Apartments
Sector 93, Gr. NOIDA Express Way
NOIDA 201304 (NCR of Delhi)
India

Stop receiving Global SMT & Packaging digital content



FEATURE ARTICLES
 

Double-sided reflow in one reflow cycle
In any process there are always opportunities to improve, reduce the number of process stages or reduce the cost of manufacture. Each may not improve yield initially, may even increase manufacturing defects, but it must in time benefit some companies’ processes or products. Engineering is always looking at alternative processes, and simultaneous double-sided reflow (SDSRS) is a possible new candidate for investigation. It has been used by two Japanese companies, one large computer manufacturer in the USA, and is reportedly being used by one other company in Europe. It was originally patented by one large US producer.
.....................................................................................................................

2009 & 2010: The coming global recovery
Global electronic business conditions began strong in 2008 but then ‘crashed and burned’ late in the year. 2008 world GDP rose 2% vs. 2007, electronic equipment revenues ‘broke even,’ printed circuit board sales dropped 6%, semiconductor $ shipments declined 2% and SEMI equipment plunged 28%.

 
 
 
FEATURE INTERVIEW
 
David Suikonen
Interview - Mandeep Singh, COO & Director, Reed Exhibitions India
“At COMPONEX NEPCON, our emphasis is on offering our exhibitors, visitors and the industry the power of ‘NEW’- new business, new products, new trends & technologies, new contacts and new ideas” said Mandeep Singh, COO & Director, Reed Exhibitions India in a conversation with Global SMT & Packaging India.
 
 
 
FEATURE INTERVIEW
 
David Suikonen
Interview - Kyle Doyel, KYZEN
Our last interview with Kyle Doyel was two years ago, when KYZEN was making its first steps into the Asian and European markets. Since then, the company has become firmly established in both markets, hiring local engineers and chemists and exporting the infamous KYZEN-friendly brand. Trevor Galbraith, Editor-in-Chief, Global SMT & Packaging magazine gets an update from Kyzen's president and CEO. Read the full interview.
 
 
 
NEW PRODUCTS
 


BEST Inc EZReball™ Reballing Preforms for Electronic Packages Down to 0.4mm pitch

BEST Inc. announces the release of the finest pitch, smallest ball diameter reballing preforms worldwide. EZReball™ reballing preforms are now available in ball sizes down to 8 mils (0.20mm). These preforms can accommodate devices down to 0.4mm pitch sizes. Solder sphere alloys are available in lead-free, tin-lead and high temperature alloys.
.....................................................................................................................

Nihon Superior Introduces SN100C P600 Halogen-Free Solder Paste
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces SN100C P600.s.
.....................................................................................................................

SIPLACE 3x8 mm shutterless S-feeder improves component supply
S-series tape feeders have been one of the most important components of many Siplace placement machines for many years.
....................................................................................................................

Bliss launches revolutionary FLEX conveyor line
Bliss Industries Inc., provider of handling carts and racks for electronics assembly, announces the launch of the revolutionary FLEXconveyor, A Box Build Factory On Wheels.
....................................................................................................................


Practical Components’ new kit checks out process cleanliness & residue
Practical Components Inc., the leading supplier of dummy components, announces that the new Practical Components B-52 CRET (Cleanliness & Residue Evaluation Test) Kit is designed to help determine the ionic cleanliness of a customer’s manufacturing process. The test boards and components follow guidelines associated with the IPC-B-52 Test Vehicle.
.....................................................................................................................

Essmtec's new high flexible pick & place machine PANFLEX2, price and performance optimised
Essemtec introduces with PANFLEX2 a high flexible high-speed pick & place machine into the market which is up to the demands of the various manufacturing of electronics. By use of the further developed X-vision-system, the PANFLEX2 offers more functionality for less money.

.... more product news

 
 
 
BREAKING NEWS
 


Jabil Circuit to move lock, stock and barrel to China from Chennai

The first crack in the edifice of the Sriperumbadur industrial corridor, near Chennai, is now visible. The US-based $12.8 billion electronics manufacturing services (EMS) giant Jabil Circuit has gone kaput, reported ET last week.
.....................................................................................................................

Bharat Electronics, Astra Microwave sign MoU for JV
JV to design and produce RF/microwave components and sub-systems for defense, space, and telecommunications. Also, to be a common platform for design, development and manufacturing of BEL's microwave intensive products.
.....................................................................................................................

Nokia cuts handset production, close R&D facility in Finland
Nokia has announced plans to close the Jyväskylä site and concentrate mobile devices R&D in Finland at Tampere, Oulu, Salo and the Helsinki metropolitan area. Nokia also plans to scale down Salo production with staggered temporary lay-offs, aligning production with market demand while continuing operations without interruption.
.....................................................................................................................

Agilent will exit automated optical, automated x-ray inspection business
Agilent Technologies Inc. on Monday announced it will exit the automated optical inspection (AOI) and automated x-ray inspection (AXI) systems business. The company reports that the decision is based on a longer-term business strategy to focus on electronic test, which has been the company's historical core competency for several decades.
....................................................................................................................

Aqueous Technologies acquires Austin American Technology’s microJet family of defluxing systems
Aqueous Technologies Corp. announces the acquisition of all marketing, sales/distribution, and service rights for the MicroJet family of conveyorized (inline) defluxing systems manufactured by Austin American Technology (Burnet, TX).
....................................................................................................................

Dixon plans LCD TV unit in Tamil Nadu
The Rs.600 crore turnover Dixon Technologies, which owns the consumer durable brand Weston, will set up a Rs. 20 crore unit to manufacture liquid crystal display (LCD) television sets at Oragadam near Chennai.

.....................................................................................................................

NMTronics introduces Oerlikon Esec products in India
NMTronics is now stepping into semiconductor market segment, which is more challenging & has tremendous potential for growth in the coming future.
.....................................................................................................................

Henkel Names New Global Sales Director for Semiconductor Materials
Henkel today announced the appointment of Mr. Luc Godefroid as the company’s Global Sales Director for its Semiconductor Group. A key member of Henkel’s electronics sales team since 2001, Godefroid’s new role sees him building on his previous success and directing the global sales efforts of Henkel’s worldwide team and expanded product portfolio.
.....................................................................................................................

National Instruments announces Top Trends in Test and Measurement for 2009
Software-defined instrumentation is year’s most significant trend for increasing performance and lowering costs.009, at BIEC, Bangalore
.....................................................................................................................

YESTech wins additional AOI contract with MC Assembly
YESTech, a subsidiary of Nordson Corporation (Nasdaq: NDSN) and a leading supplier of automated optical and x-ray inspection systems for the electronics industry, announced today that it has won a contract to provide new automated optical inspection (AOI) systems to MC Assembly, a full-service contract electronics manufacturer. MC Assembly has implemented the new F1-Series AOI automated inspection systems at their facilities located in Palm Bay, Florida and Zacatecas, Mexico.
.....................................................................................................................

IBM installs V-Works vapor phase rework system from R&D Technical Services for use on Eclipse Projec
Vapor Works, a division of R&D Technical Services Inc., announces that IBM chose and installed the V-Works Vapor Phase Rework System for use on the Eclipse Web tooling platform (WTP) project.



.... more breaking news

 
 
 
Do you have a technical solution for the industry?
Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
2008 Copyright © Trafalgar Publication
Trafalgar Publication