iNEMI project evaluates BFR-free PCB materials
Stephen Tisdale, Gary B. Long, Roger Krabbenhoft, Kostas Papathomas, Ph.D., and Terry Fischer

The electronics industry is under pressure to eliminate brominated flame retardants (BFRs) that were once widely used in electronics housings and cases and are still used extensively in printed circuit boards.
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PoP (package on package): An EMS perspective on assembly, rework and reliability
Heather McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell, Roden Cortero

While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity and seems likely to be implemented in other types of electronic assemblies.

“Our focus has to now shift to the test and measuring equipments and also to diversify in other high growth areas”, said Alok Gupta, Director, PROSEM in a conversation with Debasish Choudhury of Global SMT & Packaging India. Alok Gupta also speaks about the company's journey, evolution of the industry, government policies & regulation and his company's future growth plans.

Balver Zinn receives Corporate Sponsor of the Year award from SMTA China
The award was presented during the recent NEPCON China exhibition and conference that took place in Shanghai, China.
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OK International wins a SMT China Vision Award
Presented to OK International’s Tom Seratti, Eric Chen and Sulan Wei at a ceremony held in Shanghai during the Nepcon China exhibition, the SMT China Vision Award recognizes OK International’s important contribution in the field of hand soldering.
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NMTronics launches plasma treatment equipment for India market
NMTronics, leader in PCB assembly, testing and inspection equipment sales and service support for the EMS industry, launches equipment from Europlasma, Belgium for plasma treatment process in India.
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Techcon Systems introduces TS6500CIM series cartridge mixer
he TS6500CIM Series cartridge mixer provides complete automatic mixing of two-component material filled in a cartridge kit.
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EVS International’s EVS 7000 wins a 2009 Innovation Award
EVS International worked with the global marketplace to gain invaluable feedback from which to develop solder dross recovery solutions that satisfy the high standards required from a modern manufacturing environment — particularly with regard to reliability, ease of operation, maintenance and environmental management.
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Juki’s JX-100 wins a 2009 Innovation Award
Featuring superior cost performance, versatility, reliable quality and easy operation, JX-100 is a batch machine originally designed for developing markets. However, at its price point it is well suited for NPI and low volume/OEM applications.
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VJ Electronix’s 400ST wins a 2009 Innovation Award
VJ Electronix recently unveiled the newly expanded 400 Series Benchtop Rework Platform capable of addressing challenging Lead-Free Rework applications.
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Nihon Superior’s SN100C P600 D4 Paste Wins a 2009 SMT VISION Award
SN100C P600 is a halogen-free high-reliability no-clean lead-free solder paste that does not contain F, Cl, Br and I.
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BTU International’s PYRAMAX™ 150z12 Thermal Processing System wins a 2009 Innovation Award
The 12-zone PYRAMAX™ 150z12 system inherited the best quality, performance, and state-of-the art design of the PYRAMAX™ 125 platform, and is designed for higher throughput production.


.... more product news

Samsung to invest $20 million to expand capacity
Samsung India is eyeing 30% growth in sales revenues to reach the $2-billion mark in 2009 on the back of new product launches.
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Mobile handset outsourcing business model undergoes change
With the structure of the mobile handset supply chain upended by the global economic crisis, the old rules for the contract manufacturing of wireless devices have been overturned, leaving new pitfalls for Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Services (EMS) providers, according to iSuppli Corp.
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Essemtec AG experiences volume turnover increase
“In comparison to February 2009, we have recorded an increase in turnover of more than 15% for March 2009,” said Martin Ziehbrunner, CEO.
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Micronic Laser Systems AB intends to acquire MYDATA automation AB
Micronic Laser Systems and Skanditek Industriförvaltning have signed a letter of intent whereby Micronic intends to acquire MYDATA automation.
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RIM may add Foxconn as new EMS partner for smartphones
Research in Motion (RIM) is reportedly scouting for an EMS partner for the production of its smart-phones in Asia Pacific region.

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India's defence offsets policy to fetch $10 bn by 2011: ASSOCHAM-E&Y paper
India's defence offsets policy that mandates the reinvestment in the country of a percentage of all big ticket defence deals is expected to bring in $10 billion by 2011, says a new study by The Associated Chambers of Commerce and Industry of India (ASSOCHAM) and Ernst & Young.

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SMT equipment market on the rise in India, reports Frost & Sullivan
The Indian surface mount technologies (SMT) equipment market has witnessed rapid growth from 2003 with the growth prospects remaining good for the next 3-5 years.

.... more breaking news