EMS 'Lean Sigma' shortens cycle time, reduces costs & improves quality
MATHS E. ANDERSSON

Lean Sigma, an approach that has been in practice for several years, mixes the lean manufacturing concept and problem solving approach with Six Sigma for a more efficient manufacturing process.
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Jetting fluids in non traditional packaging and assembly applications
ALEC J. BABIARZ

The expansion of business into alternative energy, green components and energy-efficient components is having a significant impact on the electronics and semiconductor industry.

Seika Machinery, Inc. features the HIROX MX-BGAZ II lens
This BGA lens allows ball joints to be observed non-destructively.
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BPM Microsystems introduces BPWin Version 5.0
BPWin 5.0 marks a significant milestone in the release history of BPM Microsystems’ software platform.

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DEK launches Stinger; brand new low volume adhesive dispenser
Stinger adds ashesive dispensing to stencil printers.

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New SIPLACE X-Series powered by the SIPLACE MultiStar CPP head
SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continous high level of line productivity, especially in high-mix production environments.

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Freescale ships one billionth sensor, nears 30 years of sensor innovation
The extensive Freescale sensor portfolio includes MEMS-based acceleration and pressure sensors, as well as CMOS-based proximity (touch) sensors.
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Microscan introduces integrated GigE vision solution
From an economical single camera system to a sophisticated eight camera application, Microscan’s Visionscape® GigE Solution contains all the necessary components for a complete, successful machine vision implementation.
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GOEPEL electronic expands technology program for extended JTAG/Boundary Scan
The merging of iSystem’s and GOEPEL electronic’s competences marks an important step in the development and practical implementation of new elements and technologies for the IP based JTAG/Boundary Scan instrumentation.
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New AMD Opteron™ processor "Istanbul" is an Industry game-changer
AMD today announced availability of the world’s first six-core server processor with Direct Connect Architecture for two-, four- and eight-socket servers.
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Techcon Systems introduces Teflon® lined series tips
Teflon® lined tips are ideal for use with low viscosity fluids and Cyanoacrylates (super glue) material.

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Sahasra Group enhances PCB handling capability
Nano Electrotech Pvt. Ltd. (NEPL), a group company of the Sahasra Group, has placed an order for a Posalux Ultraspeed Dynamic 6000-6C.
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Scientech Technologies achieved the fastest NPI and product changeover by using SIPLACE D Series
Scientech Technologies Pvt. Ltd., has aggressively boosted up their production line.
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Global economy is stabilising, but a recovery is distant, says The Economist Intelligence Unit
An improvement in forward-looking economic indicators in recent weeks has triggered a debate about the possibility of an imminent global recovery, which has in turn helped to boost global share prices.
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Bosch starts production of Electronic Control Units in India

Bosch Automotive Electronics India Private Limited (RBAI), a 100% subsidiary of the Bosch Group, inaugurated its manufacturing plant at Naganathapura, Bangalore
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Handset OEMs get inventories under control, reports iSuppli
Global inventories of mobile handsets currently held at Handset OEM’s is 75 million units.
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CyberOptics founder and chairman Steven K. Case killed in plane crash
CyberOptics Corporation founder and chairman Steven K. Case, Ph.D., was killed on June 16, 2009 when the small plane he was flying crashed upon landing at a suburban Minneapolis airport.
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AT&S restructuring, betting big on Asia operation
AT&S will be taking steps to transfer its volume business from Europe to Asia and improve efficiency levels in Austria.

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CLIK hosting renewable energy conference
Consortium of Electronics Industries of Karnataka (CLIK) is organizing CLIKTRONIKA 09 - an international conference and trade show on renewable energy at Hotel Ashok, Bangalore during 16-18 July 2009.
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Entries for ELCINA-D&B Awards 2008-09 extended to 31st July 2009
Entries have been invited for “ELCINA – Dun & Bradstreet Awards for Excellence in Electronics Hardware Manufacturing & Services” for 2008-09, from manufacturers of electronic/IT hardware products & support services.
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CII welcomes appointment of Nandan Nilekani as Head of UIDAI
CII welcomes the Government announcement on creating the UID Authority of India (UIDAI), under the aegis of the Planning Commission, and begin the process of allocating unique identification number to the citizens of India and complete the process by 2011 for all.


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