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SMART/LEADOUT Lead-Free Implementation Seminar PDF プリント メール
作者 Global SMT & Packaging   
2006/04/12 水曜日 14:00:00 CDT

May 23rd JJS Electronics Ltd, Leicestershire 

 
Call for papers - Forum 2006 'be-flexible' PDF プリント メール
作者 Global SMT & Packaging   
2006/04/10 月曜日 14:00:00 CDT

Deadline for abstracts is June 18, 2006

 
ESCC2006 – a unique event from EIPC, CircuiTree Magazine and EMSNow PDF プリント メール
作者 Global SMT & Packaging   
2006/04/06 木曜日 14:00:00 CDT

Partnering with CircuiTree and EMSNow, the EIPC will bring global OEM, ODM, EMS, PCB makers and industry suppliers together in Cologne, Germany, on October 4-5, 2006.

 
Duo from Rockwell Collins to present Lead-Free Master Class PDF プリント メール
作者 Global SMT & Packaging   
2006/04/04 ç«æ›œæ—¥ 14:00:00 CDT

On June 21st 2006 David Hillman and Doug Pauls will present their Master Class ‘Crafting of a Lead-Free Solder Process’.

 
Conference to focus on EU member state enforcement and compliance PDF プリント メール
作者 Global SMT & Packaging   
2006/04/03 月曜日 14:00:00 CDT

IPC – Association Connecting Electronics Industries announces an “International Electronics Conference on RoHS Compliance and Beyond”.

 
NPL wins Best International Conference Paper PDF プリント メール
作者 Global SMT & Packaging   
2006/03/21 ç«æ›œæ—¥ 14:00:00 CST

Christopher Hunt, PH.D., and Martin Wickham were awarded Best International Conference Paper at IPC Printed Circuits Expo, APEX and the Designers Summit 2006.

 
Lead Free Solder Training - now in Russian PDF プリント メール
作者 Global SMT & Packaging   
2006/03/01 水曜日 14:00:00 CST

Lead-free hand soldering training is now available in a dual-language DVD - Russian / English - from IPC.

 
NEPCON 2006 to host SMART Group hands-on Lead-Free Experience PDF プリント メール
作者 Global SMT & Packaging   
2006/02/27 月曜日 14:00:00 CST

Reed Exhibitions has confirmed that Nepcon UK 2006 will again feature a complete Lead-Free Experience, presenting engineers with the opportunity to gain hands-on experience with a variety of lead-free materials and production equipment.

 
Questionnaire indicates industry will not be ready by July 1 PDF プリント メール
作者 Global SMT & Packaging   
2006/02/20 月曜日 14:00:00 CST

A survey conducted by SMART Group at the Lead-Free Seminar, ‘Question Time’ and Exhibition held in February revealed that a majority of companies either will not be ready or are uncertain of their readiness for the looming July 1 compliance date.

 
“RoHS Compliance and Beyond”, Malmo, Sweden, 25-27 April 2006 PDF プリント メール
作者 Global SMT & Packaging   
2006/02/17 金曜日 14:00:00 CST

Soldertec Global and IPC are pleased to announce details of the full session programme and exhibition for the International Conference on “RoHS Compliance and Beyond”.

 
European Semiconductor Distribution Market (DMASS) surprises with strong Fourth Quarter PDF プリント メール
作者 Global SMT & Packaging   
2006/02/16 木曜日 14:00:00 CST

An unusually strong sales growth in the traditionally weakest quarter helped the European semiconductor distribution industry to significantly reduce its decline of earlier quarters.