企業間連携

North America
Register now for SMTA lead-free programs プリント メール
作者 Global SMT & Packaging   
2006/05/02 火曜日 15:00:00 CDT

Two programs are coming up mid-May.

 
IPC releases new IMS/PCB business report プリント メール
作者 Global SMT & Packaging   
2006/05/02 火曜日 15:00:00 CDT

IPC-Association Connecting Electronics Industries announced the findings from its monthly Printed Circuit Board (PCB) Statistical Program.

 
Third annual Tin Whisker Workshop プリント メール
作者 Global SMT & Packaging   
2006/04/17 月曜日 15:00:00 CDT
Co-sponsored by iNEMI, the IEEE CPMT Society and ECTC, the event will be held on May 30.
 
Call for papers: IPC Printed Circuits Expo, APEX, Designers Summit プリント メール
作者 Global SMT & Packaging   
2006/04/12 水曜日 15:00:00 CDT

Deadline for abstracts is June 17, 2006 

 
SMTA Medical Electronics Symposium プリント メール
作者 Global SMT & Packaging   
2006/04/05 水曜日 15:00:00 CDT

The SMTA is pleased to announce the third annual SMTA MEDICAL ELECTRONICS SYMPOSIUM to be held on May 15-17 at the Sheraton Hotel Minneapolis South in Bloomington, Minnesota.

 
IPC publishes IPC-1752, Materials Declaration Management Standard プリント メール
作者 Global SMT & Packaging   
2006/03/30 木曜日 15:00:00 CST

IPC-1752 outlines a supply chain materials declaration format and process that provides a simple, effective approach to collecting, tracking and disclosing product material content information.

 
Exhibit at the 3rd annual IWLPC November 2-3 プリント メール
作者 Global SMT & Packaging   
2006/03/29 水曜日 15:00:00 CST

The SMTA and Chip Scale Review invite you to exhibit at the International Wafer-Level Packaging Conference to be held November 2-3 at the Wyndham Hotel in San Jose, California.

 
iNEMI makes recommendations for Pb-free manufacturing プリント メール
作者 Global SMT & Packaging   
2006/03/22 水曜日 15:00:00 CST

iNEMIs High-Reliability RoHS Task Force has published recommendations for Pb-free manufacturing of complex, thermally challenging electronic assemblies.

 
MEPTEC announces 4th annual MEMS Symposium プリント メール
作者 Global SMT & Packaging   
2006/03/20 月曜日 15:00:00 CST

MEMS Packaging Trends: From Production to Market Large Volume Drivers for MEMS Technologies.

 
Dont miss your opportunity to attend SMTA Boston プリント メール
作者 Global SMT & Packaging   
2006/03/03 金曜日 15:00:00 CST

SMTA Boston will be held May 9-11 at the new Boston Convention and Exhibition Center in Boston, Massachusetts, in conjunction with NEPCON East/Electro. 

 
Two industry veterans receive IPCs 2005 Hall of Fame Award プリント メール
作者 Global SMT & Packaging   
2006/03/01 水曜日 15:00:00 CST

IPC Association Connecting Electronics Industries honored Gene Weiner, Weiner & Associates, and Vern Solberg, Micro Electronic Engineering Services, with the 2005 Raymond E. Pritchard IPC Hall of Fame Award at IPC Printed Circuits Expo, APEX, and Designers Summit 2006 in Anaheim, Calif.

 
IPC Announces New Officers and Directors プリント メール
作者 Global SMT & Packaging   
2006/02/14 火曜日 15:00:00 CST

IPC Association Connecting Electronics Industries has announced the election of a new board chairman, vice chairman and secretary/treasurer plus nine board members. The officers and directors will serve through December 31, 2007. 

 
Major OEMs, EMS providers and suppliers pledge support for IPC-1752 プリント メール
作者 Global SMT & Packaging   
2006/02/11 土曜日 15:00:00 CST
The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, today announced that a significant number of its members - OEMs, EMS providers and suppliers - are committed to implementing IPC-1752, Materials Declaration Management. 
 
2005 IWLPC best paper announced プリント メール
作者 Global SMT & Packaging   
2006/02/07 火曜日 15:00:00 CST

As rated by the attendees, the Best of Conference Award at the International Wafer-Level Packaging Conference (IWLPC) held in November 2005 was presented to Peter Salmon, SysFlex, Inc (Mountain View, CA).