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協会団体ニュース
2005 IWLPC best paper announced
2006/02/07 火曜日 15:00:00 CST

As rated by the attendees, the Best of Conference Award at the International Wafer-Level Packaging Conference (IWLPC) held in November 2005 was presented to Peter Salmon, SysFlex, Inc (Mountain View, CA).

 
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