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新製品情報
New SMD Pick & Place highly accepted in the market
2006/05/02 火曜日 14:00:00 CDT
Application range includes BGA, Micro-BGA and flip chip components.
 
SUSS MicroTec extends wafer bonder portfolio
2006/04/28 金曜日 14:00:00 CDT
Elan bonders are well suited for MEMS, advanced packaging and SOI applications.
 
CeTaQ mobile services brings capability testing on-site
2006/04/27 木曜日 14:00:00 CDT

Testing directly at the machine ensures optimum accuracy.

 
Quick-swap solder pots prevent cross-contamination
2006/04/26 水曜日 14:00:00 CDT

Changeover between pots is fast and simple.

 
New Alpha flux eases lead-free transition
2006/04/25 火曜日 14:00:00 CDT
No-clean, alcohol-based flux provides best-in-class reliability, passes all international reliability standards.
 
Ovation Products introduces Quik-Lok system for MPM printers
2006/04/25 火曜日 14:00:00 CDT
Device eliminates the conventional vacuum chamber board fixture.
 
THT lead-free with Zevac
2006/04/24 月曜日 14:00:00 CDT

Zevac AG of Solothurn/Switzerland has launched the new SSM4A rework machine.

 
Pickering Interfaces introduces new LXI video matrix
2006/04/24 月曜日 14:00:00 CDT
Dual 24x8 switching matrix is specifically designed to switch video signals in 75 ohm transmission lines
 
UV adhesive dispenser provides fast, consistent application
2006/04/20 木曜日 14:00:00 CDT

EFD's 2400 Dispensing Workstation increases productivity, process control and quality.

 
Boundary scan platform SCANFLEX supports future standard PXI Express
2006/04/20 木曜日 14:00:00 CDT

The prototype of the new SCANFLEX Boundary Scan controller family (SFX controllers) is named SFX/PXIe1149-(x) and includes three models for different performance classes.

 
IMEC and University of Ghent present bendable packaged ultra-thin chips
2006/04/20 木曜日 14:00:00 CDT

The technology enables embedding packaged chips.

 
Photo Stencil announces new patented squeegee blade
2006/04/12 水曜日 14:00:00 CDT

AMTX E-Blade electroformed squeegee blade improves print deposition, quality, uniformity and consistency.

 
JNJ Industries lead eliminator removes toxic heavy metals, helps RoHS compliance
2006/04/11 火曜日 14:00:00 CDT

Lead Eliminator lifts and removes lead and heavy metals from a variety of surfaces.

 
CeTaQ announces lead-free process optimization
2006/04/11 火曜日 14:00:00 CDT

To keep defect levels down and yields up, SMT assembly equipment must operate at full performance specifications.

 
New mass imaging processes set new speed and process control standards
2006/04/10 月曜日 14:00:00 CDT

DEK has successfully developed processes for depositing silver epoxy and B-stage adhesives for die attach applications.

 
X2 the next generation, high-speed x-ray inspection system
2006/04/07 金曜日 14:00:00 CDT

Matrix Technologies introduces the first product from its new in-line x-ray system platform.

 
Dual head fluxer for selective soldering
2006/04/06 木曜日 14:00:00 CDT

A.C.E. Production Technologies introduces new Dual Head Fluxer option.

 
NAND Flash options available with latest BPWin release
2006/04/05 水曜日 14:00:00 CDT

BPWin 4.58 allows users to customize multiple partitions using a single algorithm when programming NAND devices.

 
New liquid OA flux for lead-free wave soldering tolerates high heat
2006/04/04 火曜日 14:00:00 CDT

Cobar's OA flux is designed to withstand high temperatures without breaking down. 

 
Rework for components up to 80 mm long, 70 mm clearance
2006/04/03 月曜日 14:00:00 CDT

Onyx 29 handles problem components. 

 
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