|
2006/03/24 金曜日 15:00:00 CST |
|
Schloetter provides two processes from Umicor. |
|
|
2006/03/23 木曜日 15:00:00 CST |
|
 WF-1010 VOC-free water-soluble wave solder flux is effective for use with both Sn/Pb and Pb-free assemblies.
|
|
|
2006/03/22 水曜日 15:00:00 CST |
|
Loctite 3549 high flow underfill is formulated for todays advanced CSP and BGA packages.
|
|
|
2006/03/21 火曜日 15:00:00 CST |
|
New production programming system delivers high volume
automated duplication MMC and SD cards. |
|
|
2006/03/01 水曜日 15:00:00 CST |
 Stork Veco has develops an improved stencil for component and ink
printing industries. |
|
|
2006/02/28 火曜日 15:00:00 CST |
|
High fault coverage plus flexible and efficient usage in the production process. |
|
|
2006/02/28 火曜日 15:00:00 CST |
|
Quickly and cleanly remove solder paste, lead free pastes and other stencil print materials. |
|
|
2006/02/28 火曜日 15:00:00 CST |
 As feeders index components for pick up and placement, repeatable accuracy is critical. |
|
|
2006/02/27 月曜日 15:00:00 CST |
 No other gap filling material on the market features the same level of performance and conformability. |
|
|
2006/02/27 月曜日 15:00:00 CST |
|
Schloetter offers two plating chemistries. |
|
|
2006/02/27 月曜日 15:00:00 CST |
|
The ADS 01FR turntable system was designed to lower the depaneling cost per product by maximizing throughput. |
|
|
2006/02/24 金曜日 15:00:00 CST |
|
Support for VSP devices now includes MSOP8, TSOC6 and the smallest device, SOT23. |
|
|
2006/02/24 金曜日 15:00:00 CST |
|
Place parts from 0201s to ultra fine pitch QFPs, SOICs, PLCCs, BGAs, BGAs, CSPs - even large devices such as 3mm pitch QFPs. |
|
|
2006/02/24 金曜日 15:00:00 CST |
|
New Optima II machines target economy and speed. |
|
|
2006/02/23 木曜日 15:00:00 CST |
|
ASYS Inc.'s ADS1F Modular depaneling system is developed for quick changeover environments. |
|
|
2006/02/23 木曜日 15:00:00 CST |
|
Fast, simple and cost-effective way to purge medium- to high-viscosity fluids. |
|
|
2006/02/22 水曜日 15:00:00 CST |
|
Memsstar dry release replaces wet liquid processing methods for release and surface engineering for MEMS. |
|
|
2006/02/21 火曜日 15:00:00 CST |
|
Designed for WLR, the 2200-US12-V0 station provides a complete, economical and practical 300mm solution. |
|
|
2006/02/21 火曜日 15:00:00 CST |
 Indium Corporations new WF-9942 is a powerful, no residue, no clean wave solder flux. |
|
|
2006/02/20 月曜日 15:00:00 CST |
|
Cobar BV has instituted a simple, recognizable color coding standard for all of its solder paste products. |
|
|
2006/02/18 土曜日 15:00:00 CST |
|
Aegis fuses Aegis' MES system with clients' ERP/MRP and supply chain systems. |
|
|
2006/02/16 木曜日 15:00:00 CST |
 New technology from Tecan significantly cuts production time needed to solder large RFI screening cans and fences. |
|
|
2006/02/14 火曜日 15:00:00 CST |
|
GPEL electronic introduced a new controller family for SCANFLEX: SFX/TSL1149-(x).
|
|
|
2006/02/13 月曜日 15:00:00 CST |
|
IAR Systems announces IAR Embedded Workbench for Atmels new AVR32 32-bit embedded CPU core. |
|
|
2006/02/11 土曜日 15:00:00 CST |
|
New board clamp replacement system is for manufacturers who have issues with the height of their paste deposits when printing close to their clamp foils. |
|
|
2006/02/11 土曜日 15:00:00 CST |
 New ProLINE-RoadRunner in-line
programming solution is configured specifically for Siemens X-Series
placement machines. |
|
|
2006/02/11 土曜日 15:00:00 CST |
 New Samtec SEARAY high density interconnects (SEAM/SEAF series) provide a solid grid of contacts. |
|
|
2006/02/09 木曜日 15:00:00 CST |
 Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications. |
|
|
2006/02/08 水曜日 15:00:00 CST |
|
Cyber Technologies introduces several new features to its line of CyberScan Vantage measurement systems. |
|
|
2006/02/07 火曜日 15:00:00 CST |
|
EF-6100 is the latest addition to its steadily expanding line of lead-free-friendly fluxes. |
|
