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2006/03/31 金曜日 14:00:00 CST |
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AIM's test board and kit were designed to include many
printing challenges commonly encountered on manufacturers assemblies
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2006/03/30 木曜日 14:00:00 CST |
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 New swab tests for presence of lead, new reference covers lead-free/RoHS.
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2006/03/29 水曜日 14:00:00 CST |
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 Rework stencils available for QFPs, PLCCs, BGAs, BGAs and
surface-mount connectors.
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2006/03/28 火曜日 14:00:00 CST |
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All standard True Type fonts can now be used through an easy to navigate interface.
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2006/03/28 火曜日 14:00:00 CST |
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 Labels withstand chemical and solvent washes on PCBs, are ideal for lead-free soldering baths and ovens.
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2006/03/27 月曜日 14:00:00 CST |
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 Feeders lock at the feeder rack to guarantee flexibility, stability, and easy installation and removal
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2006/03/24 金曜日 14:00:00 CST |
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Schloetter provides two processes from Umicor. |
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2006/03/23 木曜日 14:00:00 CST |
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 WF-1010 VOC-free water-soluble wave solder flux is effective for use with both Sn/Pb and Pb-free assemblies.
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2006/03/22 水曜日 14:00:00 CST |
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Loctite 3549 high flow underfill is formulated for todays advanced CSP and BGA packages.
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2006/03/21 火曜日 14:00:00 CST |
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New production programming system delivers high volume
automated duplication MMC and SD cards. |
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2006/03/01 水曜日 14:00:00 CST |
 Stork Veco has develops an improved stencil for component and ink
printing industries. |
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2006/02/28 火曜日 14:00:00 CST |
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High fault coverage plus flexible and efficient usage in the production process. |
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2006/02/28 火曜日 14:00:00 CST |
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Quickly and cleanly remove solder paste, lead free pastes and other stencil print materials. |
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2006/02/28 火曜日 14:00:00 CST |
 As feeders index components for pick up and placement, repeatable accuracy is critical. |
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2006/02/27 月曜日 14:00:00 CST |
 No other gap filling material on the market features the same level of performance and conformability. |
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2006/02/27 月曜日 14:00:00 CST |
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Schloetter offers two plating chemistries. |
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2006/02/27 月曜日 14:00:00 CST |
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The ADS 01FR turntable system was designed to lower the depaneling cost per product by maximizing throughput. |
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2006/02/24 金曜日 14:00:00 CST |
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Support for VSP devices now includes MSOP8, TSOC6 and the smallest device, SOT23. |
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2006/02/24 金曜日 14:00:00 CST |
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Place parts from 0201s to ultra fine pitch QFPs, SOICs, PLCCs, BGAs, BGAs, CSPs - even large devices such as 3mm pitch QFPs. |
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2006/02/24 金曜日 14:00:00 CST |
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New Optima II machines target economy and speed. |
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2006/02/23 木曜日 14:00:00 CST |
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ASYS Inc.'s ADS1F Modular depaneling system is developed for quick changeover environments. |
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2006/02/23 木曜日 14:00:00 CST |
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Fast, simple and cost-effective way to purge medium- to high-viscosity fluids. |
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2006/02/22 水曜日 14:00:00 CST |
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Memsstar dry release replaces wet liquid processing methods for release and surface engineering for MEMS. |
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2006/02/21 火曜日 14:00:00 CST |
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Designed for WLR, the 2200-US12-V0 station provides a complete, economical and practical 300mm solution. |
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2006/02/21 火曜日 14:00:00 CST |
 Indium Corporations new WF-9942 is a powerful, no residue, no clean wave solder flux. |
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2006/02/20 月曜日 14:00:00 CST |
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Cobar BV has instituted a simple, recognizable color coding standard for all of its solder paste products. |
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2006/02/18 土曜日 14:00:00 CST |
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Aegis fuses Aegis' MES system with clients' ERP/MRP and supply chain systems. |
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2006/02/16 木曜日 14:00:00 CST |
 New technology from Tecan significantly cuts production time needed to solder large RFI screening cans and fences. |
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2006/02/14 火曜日 14:00:00 CST |
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GPEL electronic introduced a new controller family for SCANFLEX: SFX/TSL1149-(x).
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2006/02/13 月曜日 14:00:00 CST |
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IAR Systems announces IAR Embedded Workbench for Atmels new AVR32 32-bit embedded CPU core. |
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