Arguna� 625 & 626: a pair of selective high speed silver processes 2006/02/27 月曜日 15:00:00 CST High speed selective plating equipment needs dedicated plating chemistry and Schloetter offer two processes, with or without free cyanide. The processes are mainly used for the semiconductor industry. Arguna� 625 offers a semi-bright, pleasing appearance with good bondability and solderability and a 0.3 to 1.0 microns/second plating rate. It does not contain free cyanide and uses only insoluble anodes. Arguna� 626 offers the same semi-bright appearance and good bondability/solderability, but features a 0.2 to 1.5 microns/second plating rate. It contains free cyanide and uses either soluble or insoluble anodes. www.schloetter.co.uk