iNEMI�s High-Reliability RoHS Task Force has published recommendations for Pb-free manufacturing of complex, thermally challenging electronic assemblies.

These recommendations, which focus primarily on thermal requirements for components, laminate and PWB materials and equipment, are intended to help ensure product reliability.
    
�New soldering materials, maximum qualified component temperatures and primary attach and/or rework equipment all need to be addressed relative to reliability in the face of Pb-free assembly requirements,� said Joe Smetana, principal engineer, advanced technology, for Alcatel and co-chair of the iNEMI High-Reliability RoHS Task Force. �These recommendations were developed to communicate the needs of the high reliability segment to the supply chain and the relevant standards groups that must address these needs.�

The recommendations are available on the iNEMI website at  www.inemi.org/cms/projects/ese/High_Rel_RoHS.html