�MEMS Packaging Trends: From Production to Market � Large Volume Drivers for MEMS Technologies.�

MEPTEC, the MicroElectronics Packaging and Test Engineering Council, announced its 4th Annual MEMS Packaging symposium, titled �MEMS Packaging Trends: From Production to Market � Large Volume Drivers for MEMS Technologies.� Due to popular demand, the program has been expanded to two days, including a half-day workshop on MEMS packaging standards sponsored by SEMI.  This special two-day technical event will be held on May 17 & 18, 2006 at the Hyatt San Jose (San Jose, Calif.).

MEPTEC�s Symposium Advisory Committee has segmented the program for May 17th into the following focus areas:

�    Advanced MEMS Packaging Trends and Market Overview
�    Enabling Technologies and Materials
�    Test Challenges for MEMS Applications
�    End User Applications/Future Trends

May 18th will offer attendees the opportunity to be involved in the development of a proposed set of MEMS packaging standards in a half-day workshop.  It will also include a half-day Academic Workshop where members of the academic community will present ongoing work in various stages of completion in MEMS related areas. www.meptec.org