Practical Components now supplies the AIM print test board and kit that were designed to include many printing challenges commonly encountered on manufacturers� assemblies. In addition to BGA and microBGA pads, both have circular and square pad designs to test paste release. AIM has included the standard IPC slump test pattern in order to further challenge the properties of any product tested thereon. This print pattern is more �real life� and can more accurately predict slump since individual pads are used as opposed to one pad that is common in the �thermometer� method. There is a number on the board indicating the distances between pads, ensuring that a hard number can be used for paste evaluations. www.practicalcomponents.com