DEK has successfully developed processes for depositing silver epoxy and B-stage adhesives for die attach applications, delivering higher throughput and repeatability as well as enhanced control over deposit characteristics including total thickness variation (TTV), compared to existing solutions.

DEK�s process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist, if required. DEK�s B-stage epoxy deposition process is capable of depositing a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than �5 micron, across the entire back-side of the wafer. Traditional wafer coating methods cannot match this combination of uniformity, repeatability and high throughput. www.dek.com