IMEC and its associated laboratory INTEC of the University of Ghent jointly developed a new process flow for ultra-thin chip packages resulting in bendable packaged chips of only 50�m thickness. The technology enables embedding packaged chips empowering smart, highly-integrated, flexible electronic systems for a wide variety of applications.

The process has been demonstrated with silicon chips thinned down to 20-30�m. Thanks to the very low thickness of the chip, polyimide layers and metal, a total thickness down to 50�m is achieved making the whole package bendable. The ultra-thin chip package can provide an interposer enabling testing of the chip before embedding. It offers a contact fan out with more relaxed pitches.

Thanks to its flexibility, the technology enables embedding of packaged chips in flexible boards empowering smart, highly-integrated, flexible electronic systems for a wide variety of applications such as smart textile and flexible displays. The process flow has been developed within the EU funded FP6 Integrated Project, SHIFT (Smart high-integration of flex technologies). www.imec.be