企業間連携

SMART/LEADOUT Lead-Free Implementation Seminar プリント メール
作者 Global SMT & Packaging   
2006/04/12 水曜日 15:00:00 CDT

All assemblers of printed circuit boards have to consider their approach to using lead-free solders to meet current, and future, environmental, legislative and market demands. The SMART/LEADOUT Lead-Free Implementation seminar is based at a thriving UK electronics subcontractor that recently opened a new factory in Eastern Europe. Over the past 2 years they have worked with their supply chain and customers and are at the very end of the lead-free implementation process.

The presentations will take the attendee through the whole process from inception through to having real products rolling off the end of the production line.

The workshop will be of interest to assembly inspectors, production, process and quality engineers, Quality Managers, Technical Managers, Production Managers, buyers and specifiers of electronic assemblies from contract manufacturers. Indeed anyone who will be affected by the RoHS directive. www.leadoutproject.com