Cookson Electronics Assembly Materials (CEAM) has launched ALPHA EF-6100 low-solids wave solder flux, the latest addition to its steadily expanding line of EF-Series environmentally-friendly fluxes. Designed for new lead-free processes as well as tin-lead processes, this no-clean, alcohol-based flux provides best-in-class reliability, passing all international reliability standards including IPC, Bellcore and JIS.

�ALPHA EF-6100 offers low residue for excellent board cosmetics and pin-testability for lead-free and tin-lead applications,� said Steve Brown, global product manager at CEAM. �Additionally, EF-6100 meets all IPC, Bellcore and JIS electromigration and surface insulation resistance standards � confirming its exceptional electrical reliability.� www.cooksonelectronics.com