SUSS MicroTec extends its existing wafer bonder range to include a new platform designed specifically for research, development and other low volume bonding applications. Currently the bonder carries the project name of "Elan"

Based on field proven SUSS wafer bonding technology, Elan bonders are well suited for MEMS, advanced packaging and SOI applications. As with all SUSS bonders, the Elan bonder is compatible with SUSS MA/BA Mask Aligners for wafer processes requiring precise bond alignment. There are over 1,300 SUSS manual mask aligners in the field today. www.suss.com