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NEPCON 2006 to host SMART Group hands-on Lead-Free Experience プリント メール
作者 Global SMT & Packaging   
2006/02/27 月曜日 14:00:00 CST

Reed Exhibitions has confirmed that Nepcon UK 2006 will again feature a complete Lead-Free Experience, presenting engineers with the opportunity to gain hands-on experience with a variety of lead-free materials and production equipment.

The Lead-Free Experience is a purpose-built feature area aimed at enabling engineers to build up practical knowledge of the new lead-free manufacturing environment. This forum will also provide participants with an ideal platform from which to pose lead-free questions to a team of experienced industry experts. Process issues to be covered during the informative event include lead-free soldering, inspection, component requirements, product reliability and board design.

As part of the comprehensive Experience, engineers will be invited to bring along their own board designs to work with. Participants will be able to witness and use production equipment using lead-free alloys.