|
LPKF Introduces New Laser for Depaneling |
|
|
|
作者 Nippon Administrator
|
|
2011/08/30 火曜日 17:59:49 CDT |
|
< TUALATIN, OR — June 2011 — LPKF, a leading manufacturer of laser and electronic systems, announces that another laser system by
LPKF is taking the stage. The MicroLine 1000 S presents a compact and
cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex
assembled PCBs.
Dr.
Ingo Bretthauer, Chairman of LPKF’s CEO commented, “The MicroLine 1000 S
combines a low entry-level price with the highest cutting quality and superior
process capabilities. At the same time, it is especially flexible, and
therefore suited for high manufacturing variance. We are using a laser source
that was optimized just for this application.”
With
UV-laser cutting of assembled and/or unassembled PCBs, those with limited space
will benefit. The UV laser beam can cut right along delicate components or
circuit paths without mechanical or thermal interference. The tool-less method
makes any contour possible. Changes to the cutting paths are made through
programming the software included with the machine, or right in the CAD
software.
About LPKF LPKF
Laser & Electronics is the world leading manufacturer of both mechanical
and laser systems for demanding tasks in printed circuit board technology and
microelectronics. LPKF’s worldwide headquarters is located in Garbsen, Germany
outside of Hannover and the company maintains North American headquarters in
Portland, OR.
CONTACT
Ashley
Moyer, Marketing
Coordinator
LPKF Laser & Electronics
E-mail:
このメールアドレスはスパムボットから保護されています。観覧するにはJavaScriptを有効にして下さい
Web site: www.lpkfusa.com
|
