Low-voiding lead-free solder material from Henkel delivers advantages for fine-pitch 2006/02/09 木曜日 14:00:00 CST The electronics group of Henkel announces the development of yet another advanced solder material for today�s Pb-free process requirements.  Multicore� LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5mm and 0.4mm.  Different from competitive products, Multicore LF328 has been formulated to deliver low voiding in BGA joints, which is a characteristic that delivers tremendous production advantages. In addition to its exceptional process performance, Multicore LF328 also helps lower manufacturing costs and maximizes production efficiencies.  The material produces safe residues, which eliminate the need for cleaning, and its post-reflow low color residues simplify the visual inspection process.  Multicore LF328 is classified as ROL0 to ANSI/J-STD-004.  www.electronics.henkel.com 最終更新日 ( 2006/04/20 木曜日 01:13:49 CDT )