New high density interconnect arrays available from Samtec Products News - New Products 作者 Global SMT & Packaging    2006/02/11 土曜日 14:00:00 CST New Samtec SEARAY� high density interconnects (SEAM/SEAF series) provide a solid grid of contacts on .050� (1,27mm) pitch and up to 500 I/Os.  These connectors are the same footprint as the popular SamArray� series connector, but with added features and stack heights.  Lower insertion/extraction forces make the connector much more user-friendly and a choice of solder-crimps on the tails provide a choice of traditional tin-lead alloy or RoHS compliant tin-only for lead-free processing.  Stack heights of 7mm, 8.5mm, and 10mm are offered along with array sizes of 8 or 10 rows by 20, 30, 40, or 50 pins per row. www.samtec.com