Board-level RFI screening technology cuts assembly time by 80% 2006/02/16 木曜日 14:00:00 CST New technology from Tecan can significantly cut the production time needed to solder large RFI screening cans and fences onto printed circuit boards without the use of cumbersome and expensive customized clamps or clips. OEMs, CEMs and in-house PCB assemblers can now employ a novel �barbed� retaining device that holds the screening can wall in position during reflow. The new technology involves a barbed retaining tag that is an extension of the screening can wall itself.  The tag protrudes through an oblong hole in the PCB and holds the wall / can securely in position at several points along its length.  The PCB can then be confidently reflowed with the can in position, resulting in a post-reflow assembly with consistently good solder joints. The new barbed retaining tag technology saved 80% in production time in a recent hand-soldering application. www.tecan.co.uk