ESSEMTEC AG will display its new HLX8200 pick and place at booth #D31 at the upcoming GLOBALTRONICS exhibition, scheduled to take place from October 10 to 13 in Singapore. 

EFD, Inc's improved no-clean solder paste product family makes solder joints shine.

A pricing rebound for a key type of panel indicates that the conditions in the large-sized LCD business have shifted back in favor of suppliers for the first time this year, according to iSuppli Corp. 

ProcessMate™ 6500 works with your existing dispenser to ensure consistent fluid deposits and better process control 

Highest 6 month and 12 month revenues and 500th machine shipped to the Americas. 

Global NAND flash sales declined to $2.7 billion in the second quarter, down 15.7 percent from $3.24 billion in the first quarter. In contrast, NOR flash revenue rose 6 percent and DRAM achieved a 16 percent sales increase during the second quarter. 

Continued growth for this industry stalwart and global process knowledge leader.

The companies have agreed to a cooperative marketing effort for a unique, high-speed, high-precision, automated solder paste reflow system designed to substantially increase production yields and deliver greater throughput. 

Opti-tec 7020 clear silicone potting compound from Intertronics allows circuitry to be viewed for inspection or rework purposes. 

De-lidding reduces risk of running afoul of hazardous-substance restrictions or using counterfeit or incorrect parts. 

Topical proposals are sought on the entire net production chain of the electronic assembly process. Deadline for abstracts is 13 October 2006. 

P. Kay Metal's MS2™ Molten Solder Surfactant has been proven to enhance wave soldered joints and overall product quality in addition to delivering a reduction in solder usage. 

New technology utilizes Hysol® FP5000 and Hysol® FP5001 non-conductive paste materials and process advantages to reduce warpage, eliminate voids and dramatically cut cycle time. 

Eunil H.A. Americas Inc. announces its new ECV-100 Coolveyor, a cooling conveyor system. 

Universal has launched High Performance Gold Feeders, a family of feature-loaded spliceable tape feeders designed to boost the performance of high-speed chip placement equipment, while supporting line-level  reporting and traceability functionality. 

ESSEMTEC AG's SP003 semiautomatic stencil printer is now available in a new model, the  SP003-V, with vision for faster control and alignment correction. 

Speedline Technologies announces a new chemical isolation for its popular ACCEL MicroCel S2 centrifugal cleaning system. 

Eunil H.A. Americas, Inc. announces that it has added the PARMI SPI 3-D paste inspection system to its product line.  

Flextronics International Ltd. ex-CEO Michael E. Marks received $7.4 million bonus for the fiscal year ended March 31.

In the second quarter of 2006, Henkel reported sales of 3,230 million euros, an increase of 7.3 percent.