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Smart Sonic ½ºÅÙ½Ç ¼¼Ã´ ½Ã½ºÅÛ Àμâ À̸ÞÀÏ
2010/01/11, ¿ù¿äÀÏ

 

 

 

 

 

½º¸¶Æ®¼Ò´Ð(Smart Sonic)Àº 1990³â¿¡ ÃÖÃÊÀÇ ÃÊÀ½ÆÄ ½ºÅÙ½Ç Å¬¸®³Ê¸¦ Ãâ½ÃÇß´Ù. â½ÃÀÚ ºô ½´³ªÀÌ´õ´Â ÃÖ°í±Þ ÃÊÀ½ÆÄ ½ºÅÙ½Ç Å¬¸®³Ê¸¦ Á¦ÀÛÇÏ¿© µ¶ÀÚÀûÀÎ ºê·£µå·Î È«º¸Çϰí ÀÖ´Ù.

 

 
KYZEN, Áö¼ÓÀûÀÎ ¹ßÀüÀ» ÇâÇØ ³ª°¡´Ù Àμâ À̸ÞÀÏ
2009/06/22, ¿ù¿äÀÏ

 

 

 

 

 

 

º» ÆíÁýÀåÀÌ Kyle Doyel¿Í ¸¶Áö¸·À¸·Î ÀÎÅͺ並 Çß´ø ½ÃÁ¡Àº 2³â ÀüÀ̾ú´Ù. ±× ´ç½Ã, KYZENÀº ¾Æ½Ã¾Æ¿Í À¯·´ ½ÃÀå¿¡ óÀ½ ÁøÃâÇß¾ú´ø ¶§¿´´Ù. ±× ÀÌÈÄ, ÀÌ È¸»ç´Â ¾Æ½Ã¾Æ¿Í À¯·´ Áö¿ª¿¡¼­ È®°íÇÑ ÀÔÁö¸¦ ´ÙÁö°Ô µÇ¾úÀ¸¸ç, ÇöÁö ¿£Áö´Ï¾î¿Í È­ÇÐÀÚ¸¦ °í¿ëÇÏ¿© KYZENģȭÀû ºê·£µå¸¦ ¼öÃâÇÏ°Ô µÇ¾ú´Ù. Global SMT & PackagingÀÇ Æ®·¹¹ö °¥ºê¶óÀ̽º(Trevor Galbraith) ÆíÁýÀåÀÌ ÃÖ±Ù KYZENÀÇ »ç¾÷°ú °ü·ÃµÈ À̾߱⸦ µé¾îº»´Ù

 
9.2 - R&D Å×Å©´ÏÄà ¼­ºñ½º, Áõ±â À§»ó Àåºñ ¼±µµ¾÷ü Àμâ À̸ÞÀÏ
2009/04/20, ¿ù¿äÀÏ

 

 

 

 

 

Áõ±â ¸®ÇÃ·Î¿ì ½ÃÀå ÁøÃâ ¸ñÀûÀ¸·Î 1996³â¿¡ ¼³¸³µÈ, R&D Å×Å©´ÏÄà ¼­ºñ½º(R&D Technical Services Inc.)´Â Áõ±â À§»ó Àåºñ ºÐ¾ßÀÇ ¼±µµ ±â¾÷À¸·Î ±ÞºÎ»óÇß´Ù. R&D Å×Å©´ÏÄà ¼­ºñ½ºÀÇ Áõ±â À§»ó Àåºñ´Â SMT ¼Ö´õ ¸®Ç÷οì, ¼±ÅÃÇü ºÎǰ ¸®¿öÅ©, ¹«¿¬ ¼Ö´õ¸µ, Å¥¾î¸µ, °ÇÁ¶, ±â°è½Ä ºÎÂø, ÇÃ¶ó½ºÆ½ ÆÐŰÁö Å×½ºÆ® µîÀ» Æ÷ÇÔÇØ ´Ù¾çÇÑ ½ÃÀå¿¡¼­ »ç¿ëµÇ°í ÀÖ´Ù. Global SMT & PackagingÀÇ Æ®·¹¹ö °¥ºê¶óÀ̽º(Trevor Galbraith) ÆíÁýÀåÀÌ R&D Å×Å©´ÏÄà ¼­ºñ½ºÀÇ µ¥À̺ñµå ½´ÄÚ³Ù(David Suihkonen) »çÀåÀ» ¸¸³ª Áõ±â À§»ó ±â¼ú¿¡ ´ëÇÑ À̾߱⸦ µé¾îº»´Ù.

 

 

 
9.1 - À¯¼ºÃ³·³ ¼ºÀåÇÑ Essemtec AG¸¦ ã¾Æ¼­ Àμâ À̸ÞÀÏ
2009/02/03, È­¿äÀÏ

Áö³­ 8³âÀ̶õ ½Ã°£Àº ½ºÀ§½ºÀÇ ¼Ò±Ô¸ð ±â¾÷ Essemtec AG°¡ À¯¼ºÃ³·³ ¼ºÀåÇÑ ±â°£À̶ó°í ´Ü¾ðÇÒ ¼ö ÀÖ´Ù. Essemtec AG´Â ¼öµ¿ ¹× ¼¼¹Ì-ÀÚµ¿ ÇȾØÇ÷¹À̽º Àåºñ ¼Ò±Ô¸ð Á¦Á¶¾÷ü·Î ½ÃÀÛÇØ¼­ ÇöÀç ±Û·Î¹ú ÅÏŰ ¼Ö·ç¼Ç °ø±Þ¾÷ü·Î ¿ì¶Ò ¼ºÀåÇß´Ù. ÀÌ È¸»ç´Â ¼ö¸¹Àº °æÀï¾÷ü¸¦ ÀμöÇßÀ¸¸ç ´Ù±¹Àû °Å´ë ±â¾÷µé¿¡°Ô À§ÇùÀûÀÎ ±â¾÷À¸·Î ºÎ»óÇß´Ù.
 
8.6 - Á¸ ÇÏÆ®³Ê: º¯È­¿Í ±âȸ¸¦ Æ÷ÂøÇÏ´Â Àü·«°¡ Àμâ À̸ÞÀÏ
2008/12/16, È­¿äÀÏ

 

 

 

 

Á¸ ÇÏÆ®³Ê (John Hartner)´Â ¾÷°è¿¡¼­ ºü¸£°Ô º¯È­ÇÏ´Â ±â¼úÈ帧À» ½Å¼ÓÇÏ°Ô ÆÄ¾ÇÇϸ鼭 °¡Àå ¿ªµ¿ÀûÀ¸·Î Ȱµ¿ÇÏ´Â CEO °¡¿îµ¥ ÇÑ »ç¶÷ÀÌ´Ù. ±×´Â Universal, DEK, Dover¿¡¼­ ¿äÁ÷À» ¸Ã¾Æ¿ÔÀ¸¸ç, DEK, ECT, Multitest, atg-L&M, OK International°ú À¯¸í ¾÷ü¸¦ Æ÷ÇÔÇØ Dover Electronic Technologies ȸ»çµéÀ» °ü¸®Çϰí ÀÖ´Ù. ½ÇÁ¦·Î ÃÖ±Ù Áß±¹À» ¹æ¹®ÇÑ ±â°£ µ¿¾È, ±×¸¦ ¸¸³ª¼­ ¿©·¯ °¡Áö ÁÖÁ¦·Î À̾߱⸦ ³ª´©¾î º¸¾Ò´Ù.

 
VJ Electronix, Don Naugler Àμâ À̸ÞÀÏ
2008/10/22, ¼ö¿äÀÏ

 

 

 

 

 

 

VJ ÀÏ·ºÆ®·Î´Ð½º (VJ Electronix)´Â X-·¹ÀÌ °Ë»ç Àåºñ ¹× ¸®¿öÅ© Àåºñ (SMT ¸®¿öÅ© ½ºÅ×À̼Ç) ºÐ¾ßÀÇ Àü¹® ¾÷ü·Î °¢±¤¹Þ°í ÀÖ´Ù.  ÃѰý ¸Å´ÏÀú Don Naugler¸¦ ¸¸³ª X-·¹ÀÌ Àåºñ, ¸®¿öÅ©, À¯¿¬¼º¿¡ ´ëÇÑ ÀÚ¼¼ÇÑ ¼³¸íÀ» µé¾îº»´Ù.


 
Assembleon , ´ë¿ë·® ¾ÖÇø®ÄÉÀ̼ǿë ÇÏÀÌ-¿£µå Ĩ ½´ÅÍ Àμâ À̸ÞÀÏ
2008/08/28, ¸ñ¿äÀÏ

 

 

 

 

 

´ë¿ë·® ¾ÖÇø®ÄÉÀ̼ÇÀ» À§ÇÑ ÇÏÀÌ-¿£µå Ĩ ½´ÅÍ¿¡ ´ëÇØ ¾ð±ÞÇÒ ¶§¸é, ¾î¼Àºí¸®¿Â (Assembléon)ÀÌ °¡Àå ¸ÕÀú ¶°¿À¸£´Â ȸ»ç ÁßÀÇ ÇÑ °÷ÀÌ´Ù. ¾Ë¹öÆ® º¸Ä«¸¶ (Albet Bokma)´Â ³×´ú¶õµå¿¡ ±â¹ÝÀ» µÐ ¾î¼Àºí¸®¿ÂÀÇ CCO (Chief commercial officer) Á÷Ã¥À» ¼öÇàÇϰí ÀÖ´Ù. ¹Ì±¹ ÆíÁýÀå Æ®·¹¹ö °¥ºê¶óÀ̾² (Trevor Galbraith)°¡ ¾î¼Àºí¸®¿ÂÀÇ Á¦Ç° ¹üÀ§¿Í Àü¼¼°è ºñÁî´Ï½º¿¡ ´ëÇÑ ¼³¸íÀ» µè°íÀÚ ¾Ë¹öÆ® º¸Ä«¸¶¸¦ ¸¸³ªº¸¾Ò´Ù.

 
¼Ö´õ Á¦Á¶ ¼±µµ¾÷ü Nihon Superior Àμâ À̸ÞÀÏ
2008/06/17, È­¿äÀÏ

Nihon Superior´Â ÀϺ»ÀÇ ¼±µµÀûÀÎ ¼Ö´õ Á¦Á¶¾÷ü ÁßÀÇ ÇÑ °÷ÀÌ´Ù. ÀÌ È¸»ç´Â Àü¼¼°è ÁÖ¿ä OEM ¾÷üµé°ú EMS ¾÷üµéÀÌ ÇöÀç »ç¿ëÇϰí ÀÖ´Â SN100C ¹«¿¬-¼Ö´õ¸¦ °³¹ßÇß´Ù. Global SMT & PackagingÀÇ ¹Ì ÆíÁýÀå Trevor Galbraith´Â Nihon SuperiorÀÇ Å×½´·Î ´Ï½¬¹«¶ó CEO¸¦ ¸¸³ª ÀϺ»ÀÇ ¼Ö´õ ±â¼ú ÇöȲ¿¡ ´ëÇØ ÃëÀçÇß´Ù.

 
¿Ïº®ÇÑ °í°´ ¼º°øÀ» ²Þ²Ù´Â ¹Ì¸£±â¼ú Àμâ À̸ÞÀÏ
2008/04/18, ±Ý¿äÀÏ

"MIRTEC!"  Çѱ¹¿¡ ±â¹ÝÀ»µÐ    ¹Ì¸£±â¼úÀº Ç¥¸é½ÇÀå ºÎǰ °Ë»ç±â ºÐ¾ß¿¡¼­ Àü¼¼°èÀûÀ¸·Î °¡Àå ºü¸£°Ô ¼ºÀåÇϰí ÀÖ´Â °Ë»ç Àåºñ Àü¹®¾÷ü Áß ÇÑ °÷ÀÌ´Ù. ¹Ì¸£±â¼úÀº Çѱ¹°ú Áß±¹¿¡¼­ È®°íÇÑ ¹ßÆÇÀ» ½×¾Æ¿Ô´Ù. ÀÌ È¸»ç´Â Áß±¹¿¡ ÀÌ¾î ºÏ¹ÌÁö¿ª¿¡µµ ¼º°øÀûÀ¸·Î ÁøÃâÇßÀ¸¸ç, ÃÖ±Ù À¯·´ Áö¿ªÀ» °ø·«Çϱâ À§ÇØ ¿µ±¹¿¡µµ º»ºÎ¸¦ ½Å¼³Çß´Ù. Global SMT & Packaging ÀÇ ¹Ì±¹ ÆíÁýÀå Trevor Galbraith°¡ ¹Ì¸£±â¼úÀÇ ¹ÚÂùÈ­ ´ëÇ¥À̻縦 ¸¸³ªº¸¾Ò´Ù.

 
°í°´ µ¿¹ÝÀÚ CyberOptics Àμâ À̸ÞÀÏ
2008/02/29, ±Ý¿äÀÏ

CyberOptics!    ÀüÀÚ»ê¾÷¿¡¼­ ¶°¿À¸£´Â ´Ùũȣ½º´Ù. ÀÌ È¸»ç´Â 3Â÷¿ø ÆäÀ̽ºÆ® °Ë»ç Àåºñ ºÐ¾ß¿¡¼­ ¾÷°è¸¦ ÁÖµµÇÏ´Â ¾÷ü·Î Àß ¾Ë·ÁÁ® ÀÖ´Ù. ±×·¯³ª ÀÌ È¸»ç¿¡ ´ëÇØ ¾ÆÁ÷ Àß ¾Ë·ÁÁöÁö ¾ÊÀº ºÐ¾ß´Â ¾÷°è ¼±µµÀûÀÎ ¼ö¸¹Àº Àåºñ¿¡ ´ëÇÑ ÀÎÇÁ¶ó¸¦ À§ÇØ µ¶ÀÚÀûÀÎ ±â¼úÀ» º¸À¯Çϰí ÀÖ´Ù´Â °ÍÀÌ´Ù. Global SMT & PackagingÀÇ ¹Ì±¹ ÆíÁýÀå Trevor Galbraith°¡ ÀÌ È¸»çÀÇ È¸Àå °â ¼³¸³ÀÚ Steven Case¸¦ ¸¸³ªº¸¾Ò´Ù.

 

 
Reflections by Peter Marshall, Managing Director of Process Support Products Ltd Àμâ À̸ÞÀÏ
2007/07/30, ¿ù¿äÀÏ

How times have changed to Nepcon 2007 in Birmingham where 2,500 new generation engineers visited a show now dedicated to SMT with little sign of any PCB manufacturing and only a handful of lead forming tools.

 
Guest Editorial by Paul Blundell, Chairman of Blundell Production Equipment Ltd. Àμâ À̸ÞÀÏ
2007/06/29, ±Ý¿äÀÏ

It isn’t enough to be a supplier today. You have to be a supplier, a supporter, a trainer, a consultant and a backup service, all rolled into one.

 

 
Industry Comments from Contax Ltd Àμâ À̸ÞÀÏ
2007/05/30, ¼ö¿äÀÏ

Mike Rapson, Managing Director of Contax Limited, said : "In the UK, the future is looking bright, with many CEMs now operating at near to full capacity. In some instances, this has had a knock-on effect, with smaller OEMs now investing in entry level batch systems to ensure that they can always meet their production targets".

 
Paul Walter Interview Àμâ À̸ÞÀÏ
2007/04/04, ¼ö¿äÀÏ
Global SMT & Packaging’s Andy Kellard asks Dage’s MD Paul Walter about the background of the acquisition and what lies ahead for the UK-based manufacturer of x-ray inspection and bond test systems.
 
7.1 - Pat Trippel Interview Àμâ À̸ÞÀÏ
2007/02/07, ¼ö¿äÀÏ
Global SMT & Packaging editor Trevor Galbraith spoke to Henkel electronics group president Pat Trippel about the constant challenges facing materials suppliers in a fast-paced manufacturing world.
 
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