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CeTaQ announces placement feeder verification capability
2006/02/28, È­¿äÀÏ
As feeders index components for pick up and placement, repeatable accuracy is critical.
 
Arguna® 625 & 626: a pair of selective high speed silver processes
2006/02/27, ¿ù¿äÀÏ
Schloetter offers two plating chemistries.
 
Maximum productivity with ASYS Depaneling System ADS 01FR
2006/02/27, ¿ù¿äÀÏ
The ADS 01FR turntable system was designed to lower the depaneling cost per product by maximizing throughput.
 
BP Microsystems adds support for VSP devices
2006/02/24, ±Ý¿äÀÏ
Support for VSP devices now includes MSOP8, TSOC6 and the smallest device, SOT23.
 
6400 pph pick & place machine offers speed, flexibility, value
2006/02/24, ±Ý¿äÀÏ
Place parts from 0201s to ultra fine pitch QFPs, SOICs, PLCCs, BGAs, µBGAs, CSPs - even large devices such as 3mm pitch QFPs.
 
New AOI products target low-cost and high-volume electronics manufacturers
2006/02/24, ±Ý¿äÀÏ
New Optima II machines target economy and speed.
 
Innovative depaneling for the most demanding quick change-over requirements
2006/02/23, ¸ñ¿äÀÏ
ASYS Inc.'s ADS1F Modular depaneling system is developed for quick changeover environments.
 
Fast, affordable way to purge bubbles and trapped air from thick assembly fluids
2006/02/23, ¸ñ¿äÀÏ
Fast, simple and cost-effective way to purge medium- to high-viscosity fluids.
 
Memsstar® launches full product range to MEMS and Nano markets
2006/02/22, ¼ö¿äÀÏ
Memsstar® dry release replaces wet liquid processing methods for release and surface engineering for MEMS.
 
Digi-Key expands Micron line to include imaging products
2006/02/21, È­¿äÀÏ

Micron Technology’s high-performance imaging products are now available through Digi-Key’s worldwide distribution channel.

 
Micromanipulator introduces 300mm reliability probe station
2006/02/21, È­¿äÀÏ
Designed for WLR, the 2200-US12-V0 station provides a complete, economical and practical 300mm solution.
 
Indium Corporation introduces Pb-free transition wave solder flux
2006/02/21, È­¿äÀÏ
Indium Corporation’s new WF-9942 is a powerful, no residue, no clean wave solder flux.
 
Cobar ‘going green’ to prevent lead-free mix-ups
2006/02/20, ¿ù¿äÀÏ
Cobar BV has instituted a simple, recognizable color coding standard for all of its solder paste products.
 
Aegis launches xTend for seamless integration to business systems
2006/02/18, Åä¿äÀÏ
Aegis fuses Aegis' MES system with clients' ERP/MRP and supply chain systems.
 
“RoHS Compliance and Beyond”, Malmo, Sweden, 25-27 April 2006
2006/02/17, ±Ý¿äÀÏ

Soldertec Global and IPC are pleased to announce details of the full session programme and exhibition for the International Conference on “RoHS Compliance and Beyond”.

 
Board-level RFI screening technology cuts assembly time by 80%
2006/02/16, ¸ñ¿äÀÏ
New technology from Tecan significantly cuts production time needed to solder large RFI screening cans and fences.
 
European Semiconductor Distribution Market (DMASS) surprises with strong Fourth Quarter
2006/02/16, ¸ñ¿äÀÏ

An unusually strong sales growth in the traditionally weakest quarter helped the European semiconductor distribution industry to significantly reduce its decline of earlier quarters.

 
IPC/Soldertec International Lead-free Conference, April 25, 2006 Malmo, Sweden
2006/02/15, ¼ö¿äÀÏ

Two half-day courses will be given at the Hilton Malmo City in Malmo, Sweden, by Dr. Jennie Hwang, author of <i>Lead-free Implementation: A Guide to Manufacturing</i> and <i>Environment-Friendly Electronics, Lead Free Technology</i>.

 
Schloetter announce management change
2006/02/15, ¼ö¿äÀÏ

After 23 years impressive service, Schloetter’s commercial director, David Harris, has retired with effect from the year-end 2005. 

 
Boundary scan platform SCANFLEX® meets FireWire
2006/02/14, È­¿äÀÏ

GÖPEL electronic introduced a new controller family for SCANFLEX®: SFX/TSL1149-(x).

 
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