As industry moves to lead-free soldering, tin has replaced lead in a majority of the new solder formulas and also in component coatings and leads.

This paper will help you understand the process of lead-free rework of  package-on-package (POP) mounted on a PCB, which is new technology already being used in high-end graphics cards and mobile phones.

This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes.

When industry announced the intention to eliminate lead (Pb) from the soldering process, a number of experiments were performed to test the cleaning efficacy of Pb-free soldering materials.

As more electronic assemblers move to lead free SMT production, concerns are raised over reflow cooling slopes and effects on solder joints.

Rampant counterfeiting in regions such as Asia has made strict research into the documentation and authenticity of chips an essential prerequisite for accepting ICs for integration into manufactured products.

In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. However, as SMT requirements became more complex and, consequently, more demanding, so did the requirements for complex step stencils.

Just because a material is free of the RoHS list of excluded substances, doesn’t mean it can withstand processing at the elevated temperatures of lead-free.  

This white paper addresses six questions relating to the phenomenon of tin whiskers.

One area of interest that requires additional experimentation and understanding is the ability of the Pb-free alloys to self-center offset components compared to the Sn/Pb alloy.

Typically, dispensing platform specifications do not include the error associated with positional mechanisms, which greatly contributes to final accuracy and repeatability.

This paper describes a practical approach to characterizing the thermal performance of similarly configured rework systems, with the aim of yielding like thermal performance.

There are several steps in determining IF and HOW to implement a de-fluxing strategy. Lead-free soldering and reflow environments mandate a more critical de-fluxing due-diligence process.