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Issue 8.5 September/Octorber 2008
- VTP ÀÎÅÍÄ¿³ØÆ® ÀÌ¿ëÇÑ ¿þÀÌÆÛ ·¹º§ ijºñƼ ÆÐŰÁö
- °í¼º´É TIMÀ» À§ÇÑ ³ª³ë±â¼ú ¹× ¼öÇÐÀû ±â¹ý
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... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä. |
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Issue 8.4 July/ August 20008
- °í¼º´É ¼¼Ã´ °øÁ¤ ±â¼ú
- PCB ¾î¼Àºí¸® ÃÖÀûȽÃŰ´Â ¿Âµµ ÇÁ·ÎÆÄÀϸµ
- SoP¸¦ ÀÌ¿ëÇÑ °íÁýÀû PoP ±¸Çö °úÁ¦
... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä. |
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Issue 8.3 May/ June 20008
- ¿Âµµ º¯È¿¡ µû¸¥ ÈÚ Çö»ó ÃøÁ¤ ±â¹ý
- °í¼Ó ÇÏÁ߽à ¹«¿¬ BGA º¼ÀÇ °µµ
- ¿ Àüµµ¼ºÀÌ ¿ì¼öÇÑ ±Ý¼Ó TIM
- PCBÀÇ ¿ ¼º´É ¹× ±â°èÀû ¼º´É ÃÖÀûÈ ¹æ¹ý
- ¸° Á¦Á¶ ȯ°æ¿¡¼ Ç÷¹ÀÌ¸ÕÆ® ÃÖÀûÈ ±â¹ý
... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.
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Issue 8.2 March/April 2008
Çʸ§ vs. ÆäÀ̽ºÆ®: ÀûÃþ ´ÙÀÌ ¾ÖÇø®ÄÉÀÌ¼Ç¿ë ´ÙÀÌ Á¢Âø±â¼ú
- ÀÓº£µðµå ¿Àü±â ³Ã°¢
- ÃÖÀûÀÇ ¿Àºì ·¹½ÃÇÇ ¼±ÅÃ, ¼ÒºñÀü·Â Àý°¨
- ¼Ö´õ ÆäÀ̽ºÆ®ÀÇ ±âº» ¿ø¸®
... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.
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Issue 8.1 - January/February 2008
- ¼¼Ã´ °øÁ¤À» À§ÇÑ Å×½ºÆ® Ç÷§Æû °³¹ß ¹× °ËÁõ 1´Ü°è
- PIHR ¹× ¹«¿¬ ¼Ö´õ Á¢ÇÕºÎ
- PoP °øÁ¤ °³¹ß ¹× ½Å·Ú¼º Æò°¡
- ¿þÀÌºê ¼Ö´õ: º¹ÀâÇÑ º¸µå¸¦ °£´ÜÈ÷ ÇÏ´Â ÃÖÀûÈ °øÁ¤
... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä. |
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Issue 7.9 - September 2007
- Wave solder: Process optimization for simple to complex boards by Denis Barbini and Paul Wang
- Solder-free assembly - A more environmentally friendly alternative to lead-free by Joe Fjelstad
- Vapor phase for lead-free reflow by David Suihkonen
...and more. Click for full table of contents. |
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Issue 7.8 - August 2007
- Optical silicones for use in harsh operating environments by Bill Riegler, Stephen Bruner and Rob Thomaier
- Obtaining and controlling reflow oven cooling rates by Fred Dimock and Rob DiMatteo
- Roxton™, the next generation of SMT nozzles by Dr Hywel Jones
- Beating the chip counterfeiters by Keith Bryant
...and more. Click for full table of contents. |
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Issue 7.7 - July 2007
- Medical electronics pose unique challenges by Anthony Primavera, Roger Roberts, Ravi Subrahmanyan
- Market trends for 3D stacking by Dr. Eric Mounier
- Liquid tin corrosion and lead free wave soldering by Jim Morris; Matthew J. O’Keefe, Ph.D.; Martin Perez, Ph.D
...and more. Click for full table of contents. |
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Issue 7.6 - June 2007
- Advanced coating technologies for lead-free solders by Bill Boyd
- iNEMI Updates Tin Whisker Recommendations by Joe Smetana
- Is tin heading for a crisis? (part two) by Peter Kettle
...and more. Click for full table of contents. |
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Issue 7.5 - May 2007
- Global impact of the accelerating cost increase of metals by Bruce S. Moloznik, Mitch Holtzer, Stan Rothschild, Doug Dixon, Ross Berntson
- Reliability of tacky fluxes in varying soldering applications by Brian Smith, Jennifer Allen, John Tuccy
- Measuring true temperature in lead-free assembly by Yoshinobu Anbe
- An economical alternative to boundary scan in memory devices by The IEEE P1581 Working Group
...and more. Click for full table of contents. |
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