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9.3 June/July 2009

Issue 9.3 June/July 2009  

 

  • ÇÉÀÎȦ Á¦Ç°ÀÇ ¼Ö´õ º¸À̵堹®Á¦ Çذá 
  • ÀüÀÚºÎǰ ÆÐŰ¡À» À§ÇÑ ¿­ Àüµµ¼º ¾×»ó ¼ÒÀç
  •  ¼±ÅÃÀû ¼Ö´õ¸µ °øÁ¤¿¡¼­ PCB ·¹À̾ƿô ¹× ¼Ö´õ¸µ ³ëÁñ ¼³°è
     
     

     

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Å¬¸¯Çϼ¼¿ä.  

 

 

 
9.2 - March/April 2009

Issue 9.2 March/April 2009

  • ´ë¾ÈÀû ¹«¿© ¼Ö´õ ÇÕ±ÝÀÇ Æò°¡¸¦ À§ÇÑ Å×½ºÆ® µ¥ÀÌÅÍ ¿ä°Ç
  • SMT¿¡¼­ SPC Àû¿ë ¹× »ç¿ë»ó ¾î·Á¿î Á¡
  • °øÁ¤¼º´É Áö¼ö: ÃÖÀûÀÇ Àåºñ ¼º´É Æò°¡ ¹æ¹ý
  • ´ÜÀÌ °øÁ¤À¸·Î ¹«¿¬ ¹× À¯¿¬ PCB Ŭ¸®´×À» ÇÒ ¼ö Àִ°¡?
  • ·¹ÀÌÀú - À¯¿¬ÇÑ PCB ¸®¿öÅ© Åø

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Å¬¸¯Çϼ¼¿ä. 

 

 
9.1 - January/February 2009

Issue 9.1 January/February 2009

 

  • PCA¿¡¼­ ¹«¿¬ Ç÷°½º ÀÜ·ù¹° Á¦°Å¸¦ À§ÇÑ ¼¼Á¤°øÁ¤ ¹æ¹ý  
  • Æú¸®¸Ó¿Í Ç÷¯½ºÀÇ È¥¿ë¼º ¹®Á¦  
  • 01005 ¾î¼Àºí¸® °øÁ¤ - º¸µå ¼³°èºÎÅÍ ¸®ÇÃ·Î¿ì °øÁ¤±îÁö
  • "Àü¼º±â¸¦ ¸ÂÀº ±â¾÷ÀÇ ±â³ä½ÄÀ» ÃàÇÏÇϸ鼭"
  • 2008³âµµ Àü¼¼°è À¯Åë¾÷ü ¸®ºä

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Å¬¸¯Çϼ¼¿ä.

 

 
8.6 - Nov/Dec 2008

Issue 8.6 November/December 2008

  • Ç¥¸é ½ÇÀå ÆÐŰÁöÀÇ ¼Ö´õ º¼ žÀç ±â¼ú Çâ»ó 
  • ¿þÀÌÆÞ ·¹º§ µð¹ÙÀ̽º ÅëÇÕÀÇ ¹®Á¦ ÇØ°á
  • PCB »ý»ê & Å×½ºÆ®: ¹«¿¬ °øÁ¤

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

 
8.5 Sep/Oct 2008

Issue 8.5 September/Octorber 2008

  • VTP ÀÎÅÍÄ¿³ØÆ® ÀÌ¿ëÇÑ ¿þÀÌÆÛ ·¹º§ ijºñƼ ÆÐŰÁö
  • °í¼º´É TIMÀ» À§ÇÑ ³ª³ë±â¼ú ¹× ¼öÇÐÀû ±â¹ý
  • ÇÁ¸°Æ® ¼º´É Çâ»ó½ÃŰ´Â ¸éÀû ºñÀ² ¹Î°¨µµ ºÐ¼®

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

 
8.4 - July/August 2008

Issue 8.4 July/ August 20008

  • °í¼º´É ¼¼Ã´ °øÁ¤ ±â¼ú
  • PCB ¾î¼Àºí¸® ÃÖÀûÈ­½ÃŰ´Â ¿Âµµ ÇÁ·ÎÆÄÀϸµ 
  • SoP¸¦ ÀÌ¿ëÇÑ °íÁýÀû PoP ±¸Çö °úÁ¦

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

 
8.3 - May/ June 2008

Issue 8.3 May/ June 20008

  • ¿Âµµ º¯È­¿¡ µû¸¥ ÈÚ Çö»ó ÃøÁ¤ ±â¹ý 
  • °í¼Ó ÇÏÁ߽à ¹«¿¬ BGA º¼ÀÇ °­µµ
  • ¿­ Àüµµ¼ºÀÌ ¿ì¼öÇÑ ±Ý¼Ó TIM
  • PCBÀÇ ¿­ ¼º´É ¹× ±â°èÀû ¼º´É ÃÖÀûÈ­ ¹æ¹ý
  • ¸° Á¦Á¶ ȯ°æ¿¡¼­ Ç÷¹ÀÌ¸ÕÆ® ÃÖÀûÈ­ ±â¹ý

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

 

 


 
8.2 - March/April 2008

Issue 8.2 March/April 2008

  • Çʸ§ vs. ÆäÀ̽ºÆ®: ÀûÃþ ´ÙÀÌ ¾ÖÇø®ÄÉÀÌ¼Ç¿ë ´ÙÀÌ Á¢Âø±â¼ú
  • ÀÓº£µðµå ¿­Àü±â ³Ã°¢
  • ÃÖÀûÀÇ ¿Àºì ·¹½ÃÇÇ ¼±ÅÃ, ¼ÒºñÀü·Â Àý°¨
  • ¼Ö´õ ÆäÀ̽ºÆ®ÀÇ ±âº» ¿ø¸®

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

 

 
8.1 - January/February 2008

Issue 8.1 - January/February 2008

  • ¼¼Ã´ °øÁ¤À» À§ÇÑ Å×½ºÆ® Ç÷§Æû °³¹ß ¹× °ËÁõ 1´Ü°è
  • PIHR ¹× ¹«¿¬ ¼Ö´õ Á¢ÇÕºÎ
  • PoP °øÁ¤ °³¹ß ¹× ½Å·Ú¼º Æò°¡
  • ¿þÀÌºê ¼Ö´õ: º¹ÀâÇÑ º¸µå¸¦ °£´ÜÈ÷ ÇÏ´Â ÃÖÀûÈ­ °øÁ¤

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

 
7.9 - September 2007

Issue 7.9 - September 2007

  • Wave solder: Process optimization for simple to complex boards by Denis Barbini and Paul Wang
  • Solder-free assembly - A more environmentally friendly alternative to lead-free by Joe Fjelstad
  • Vapor phase for lead-free reflow by David Suihkonen

...and more. Click for full table of contents.

 
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