Issue 9.2 March/April 2009

• ´ë¾ÈÀû ¹«¿© ¼Ö´õ ÇÕ±ÝÀÇ Æò°¡¸¦ À§ÇÑ Å×½ºÆ® µ¥ÀÌÅÍ ¿ä°Ç
• SMT¿¡¼­ SPC Àû¿ë ¹× »ç¿ë»ó ¾î·Á¿î Á¡
• °øÁ¤¼º´É Áö¼ö: ÃÖÀûÀÇ Àåºñ ¼º´É Æò°¡ ¹æ¹ý
• ´ÜÀÌ °øÁ¤À¸·Î ¹«¿¬ ¹× À¯¿¬ PCB Ŭ¸®´×À» ÇÒ ¼ö Àִ°¡?
• ·¹ÀÌÀú - À¯¿¬ÇÑ PCB ¸®¿öÅ© Åø

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Å¬¸¯Çϼ¼¿ä. 

Issue 9.1 January/February 2009

• PCA¿¡¼­ ¹«¿¬ Ç÷°½º ÀÜ·ù¹° Á¦°Å¸¦ À§ÇÑ ¼¼Á¤°øÁ¤ ¹æ¹ý  
• Æú¸®¸Ó¿Í Ç÷¯½ºÀÇ È¥¿ë¼º ¹®Á¦  
• 01005 ¾î¼Àºí¸® °øÁ¤ - º¸µå ¼³°èºÎÅÍ ¸®ÇÃ·Î¿ì °øÁ¤±îÁö
• "Àü¼º±â¸¦ ¸ÂÀº ±â¾÷ÀÇ ±â³ä½ÄÀ» ÃàÇÏÇϸ鼭"
• 2008³âµµ Àü¼¼°è À¯Åë¾÷ü ¸®ºä

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Å¬¸¯Çϼ¼¿ä.

Issue 8.6 November/December 2008

• Ç¥¸é ½ÇÀå ÆÐÅ°ÁöÀÇ ¼Ö´õ º¼ žÀç ±â¼ú Çâ»ó 
• ¿þÀÌÆÞ ·¹º§ µð¹ÙÀ̽º ÅëÇÕÀÇ ¹®Á¦ ÇØ°á
• PCB »ý»ê & Å×½ºÆ®: ¹«¿¬ °øÁ¤

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

Issue 8.5 September/Octorber 2008

• VTP ÀÎÅÍÄ¿³ØÆ® ÀÌ¿ëÇÑ ¿þÀÌÆÛ ·¹º§ ijºñƼ ÆÐÅ°Áö
• °í¼º´É TIMÀ» À§ÇÑ ³ª³ë±â¼ú ¹× ¼öÇÐÀû ±â¹ý
• ÇÁ¸°Æ® ¼º´É Çâ»ó½ÃÅ°´Â ¸éÀû ºñÀ² ¹Î°¨µµ ºÐ¼®

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

Issue 8.4 July/ August 20008

• °í¼º´É ¼¼Ã´ °øÁ¤ ±â¼ú
• PCB ¾î¼Àºí¸® ÃÖÀûÈ­½ÃÅ°´Â ¿Âµµ ÇÁ·ÎÆÄÀϸµ 
• SoP¸¦ ÀÌ¿ëÇÑ °íÁýÀû PoP ±¸Çö °úÁ¦

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

Issue 8.3 May/ June 20008

• ¿Âµµ º¯È­¿¡ µû¸¥ ÈÚ Çö»ó ÃøÁ¤ ±â¹ý 
• °í¼Ó ÇÏÁ߽à ¹«¿¬ BGA º¼ÀÇ °­µµ
• ¿­ Àüµµ¼ºÀÌ ¿ì¼öÇÑ ±Ý¼Ó TIM
• PCBÀÇ ¿­ ¼º´É ¹× ±â°èÀû ¼º´É ÃÖÀûÈ­ ¹æ¹ý
• ¸° Á¦Á¶ ȯ°æ¿¡¼­ Ç÷¹À̸ÕÆ® ÃÖÀûÈ­ ±â¹ý

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

Issue 8.2 March/April 2008

• Çʸ§ vs. ÆäÀ̽ºÆ®: ÀûÃþ ´ÙÀÌ ¾ÖÇø®ÄÉÀÌ¼Ç¿ë ´ÙÀÌ Á¢Âø±â¼ú
• ÀÓº£µðµå ¿­Àü±â ³Ã°¢
• ÃÖÀûÀÇ ¿Àºì ·¹½ÃÇÇ ¼±ÅÃ, ¼ÒºñÀü·Â Àý°¨
• ¼Ö´õ ÆäÀ̽ºÆ®ÀÇ ±âº» ¿ø¸®

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

Issue 8.1 - January/February 2008

• ¼¼Ã´ °øÁ¤À» À§ÇÑ Å×½ºÆ® Ç÷§Æû °³¹ß ¹× °ËÁõ 1´Ü°è
• PIHR ¹× ¹«¿¬ ¼Ö´õ Á¢ÇÕºÎ
• PoP °øÁ¤ °³¹ß ¹× ½Å·Ú¼º Æò°¡
• ¿þÀÌºê ¼Ö´õ: º¹ÀâÇÑ º¸µå¸¦ °£´ÜÈ÷ ÇÏ´Â ÃÖÀûÈ­ °øÁ¤

... ±âŸ ´Ù¸¥ ±â»ç ¹× ¸ñÂ÷¸¦ º¸½Ã·Á¸é ¿©±â¸¦ Ŭ¸¯Çϼ¼¿ä.

Issue 7.9 - September 2007

• Wave solder: Process optimization for simple to complex boards by Denis Barbini and Paul Wang
• Solder-free assembly - A more environmentally friendly alternative to lead-free by Joe Fjelstad
• Vapor phase for lead-free reflow by David Suihkonen

...and more. Click for full table of contents.

Issue 7.8 - August 2007

• Optical silicones for use in harsh operating environments by Bill Riegler, Stephen Bruner and Rob Thomaier
• Obtaining and controlling reflow oven cooling rates by Fred Dimock and Rob DiMatteo
• Roxton™, the next generation of SMT nozzles by Dr Hywel Jones
• Beating the chip counterfeiters by Keith Bryant

...and more. Click for full table of contents.