Issue 7.2 - February 2007

• The validation of SAC305 and SnCu-based solders at the contract assembler level by Peter Biocca, Carlos Rivas
• Process improvement with selective solder by John Weisheit, Tom Barnard
• Evaluation of wafer bumping stencils by Scott F. Popelar, Robert A. Niemet
• Integrating strategic alliances in product development and manufacturing by Larry Fleming

...and more. Click for full table of contents.

Issue 7.1 - January 2007

• Ten lessons learned in cleaning Pb-free flux residues by Mike Bixenman, Erik Miller and Fernando Rueda
• Characterizing mechanical stress by Soeren Hirsch, Soeren Majcherek and Bertram Schmidt
• Low-warpage molding compound development for array packages by Irving Y. Chien, Jack Zhang, Lou Rector and Michael Todd
• XRF - A reality check by Sia Afshari and W.J. Hall

...and more. Click for full table of contents. 

Issue 6.10 - November/December 2006

• ‘Delidding’ ICs to verify chip authenticity by Joel Deutsch
• Inventory management: combining business intelligence & material handling hardware by Bob Douglas
• The capability of modern AOI systems by Jens Kokott
• Tin-copper based solder options for lead-free assembly by Peter Biocca

Tin-copper based solder options for lead-free assembly by Peter Biocca

...and more. Click for full table of contents. 

Issue 6.9 - October 2006

• Key differences between EU RoHS and China RoHS by John H. Lau
• Step stencils by William E. Coleman Ph.D. and Michael R. Burgess
• Improved BGA shock and bend performance using corner glue epoxies by Michael Kochanowski and Brian Toleno

...and more. Click for full table of contents. 

Issue 6.8 - September 2006

• How to clean lead-free materials by Thomas M. Forsythe
• Atmospheric plasma – A new surface treatment technology for cleaning PCBs by Rory A. Wolf
• Alternative technologies for lead-free defluxing by Michael T. Konrad

...and more. Click for full table of contents. 

Issue 6.7 - August 2006

• Status of EU RoHS exemptions by John H. Lau
  
• Performance of printable phase change materials by Devesh Mathur, Ph.D.
  
• Evaluating new polyurethane systems (PUR) in micro optics and optical casting by Manfred Supra Ph. D.
  
• Survey of RFID case studies by Francois Monette

Issue 6.6 / June/July 2006

• Standardizing cleanliness criteria for fiber optic connectors cuts costs, improves quality by Tatiana Berdinskikh, Sun-Yuan Huang, Heather Tkalec, Douglas H. Wilson, Frank (Yi) Zhang
• Fine pitch component self-alignment with Sn/Pb and Sn/Ag/Cu solders by Minna Arra, David Geiger, Dongkai Shangguan and Jonas Sjöberg
• Conductive adhesives and Nanotechnology - alternatives for lead-free soldering by Frank Liotine, Jr.

...and more. Click for full table of contents.

Issue 6.5 / May 2006

• "IC package qualification testing for lead-free soldering" by Vern Solberg
• "Thermal process optimization provides reduced energy consumption" by Piotr Kanica
• "High performance flip-chip packages with copper pillar bumping" by Joachim Kloeser, Ernst Weissbach

...and more. Click for full table of contents.

Issue 6.4 / April 2006

• "Single ball reballing and repair of BGA components" by Robert V. Avila
• "Maximizing the 'value-add' of the electronic materials partner" by George A. Toskey
• "Fact and fiction of lead-free soldering" by Keith Sweatman
• "Why solder spikes form" by Yoshinobu Anbe

...and more. Click for full table of contents.

Issue 6.3 / March 2006

• "Advances in jetting small dots of high viscosity fluid for electronic and semiconductor packaging" by Alec J. Babiarz
• "Printing the electronic future" by Dr Peter Harrop
• Global Technology Awards - winners profiles
• Pat Flynn Interview - ECT Technologies Inc.

...and more. Click for full table of contents.