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Ansoft releases Nexxim v3.5
2006/11/03, ±Ý¿äÀÏ

New version expands simulation capabilities of communication ICs and high-speed designs

 
Flexible interconnect system for high-speed applications to 12.5Gbps
2006/11/02, ¸ñ¿äÀÏ

A sophisticated high-performance flexible interconnect system is now available from ACAL Radiatron offering design engineers and system builders a compact alternative to traditional options.

 
MM-16: fast and low-cost spectroscopic ellipsometer and Mueller polarimeter
2006/11/02, ¸ñ¿äÀÏ

The spectroscopic ellipsometer is dedicated to the advanced characterization of film thickness and optical constants for a broad range of materials such as semiconductors, compounds, alloys and organic thin films.

 
Aeroflex adds channel fading capability to its 6401 AIME 3G mobile protocol test system
2006/11/02, ¸ñ¿äÀÏ

The 6401 AIME’s new radio channel emulation capability addresses and overcomes the inherent drawbacks of traditional RF based radio channel emulation methods by integrating these functions at baseband.

 
National Semiconductor introduces world's smallest, fully integrated flash LED driver
2006/11/02, ¸ñ¿äÀÏ

High power LED driver is optimised for driving single- and multiple-die flash LED technologies in handheld applications.

 
Cobar Solder Products offers CobarCore lead-free solder
2006/11/01, ¼ö¿äÀÏ

CobarCore’s synthetic polymer technology delivers excellent wetting, bright solder joints, and clear, non-corrosive residues. Cobar Core is available in a range of sizes and flux content, and are totally lead-free compatible.

 
New compact surface mounter features enhanced accuracy and dramatically reduced maintenance
2006/10/31, È­¿äÀÏ

Sony Manufacturing Systems Europe has extended its successful range of cellular electronic production equipment with the announcement of a new high-reliability surface mounter which can place components to an accuracy of ±45µm.

 
Sonoscan ships new-generation wafer inspection system
2006/10/27, ±Ý¿äÀÏ

Voids, disbonds, cracks and solid particles that can cause failure in subsequent processing steps are sharply defined in the acoustic image.

 
Enhanced stencil and squeegee technology significantly improves lead-free printing
2006/10/26, ¸ñ¿äÀÏ

A combination of proven design features have been brought together to ensure lead-free printing success through the adoption of stencils and squeegees from Tecan.

 
IP Systems introduces new filter unit for ovens and selective soldering
2006/10/25, ¼ö¿äÀÏ

The new F3200 filter unit has an airflow rating of 600 cfm and therefore is ideal for the exhaust filtration of ovens and selective soldering systems.

 
OK International launches high power, mainstream market soldering system
2006/10/25, ¼ö¿äÀÏ

Characterised by an innovative power coil assembly, advanced tip geometry and an extended easy access tip range, the PS-800E features a larger conductive area for more efficient thermal energy transfer.

 
New XiDAT 2.0 with 2M pixel imaging system from Dage
2006/10/25, ¼ö¿äÀÏ

This new XiDAT 2.0 image acquisition system is capable of capturing and displaying a 2M pixel image at a full 30 frames/second on a 24" monitor, a first in the industry taking the size of the image and image quality a quantum leap forward.

 
A.C.E. introduces large format KISS 104 automated selective soldering system
2006/10/25, ¼ö¿äÀÏ

SMEMA-compatible KISS 104 offers all of the popular features found in the KISS 101 and 102 systems, but in a larger format to handle larger PCB’s and panelized boards, and in-line integration capability.

 
XMC: New software package for Viscom X-ray inspection systems
2006/10/24, È­¿äÀÏ

Viscom’s new XMC software package delivers significant improvements and convenient new features to users of Viscom manual and semi-automatic X-ray systems.

 
Panoramic view of concealed solder joints
2006/10/24, È­¿äÀÏ

Viscom not only provides complete X-ray systems, but is also a highly sought-after supplier of Series XT9000 Microfocus X-ray tubes for OEM partners throughout the world.

 
Viscom S3016 – Flexible, robust solder joint inspection underneath the PCB
2006/10/24, È­¿äÀÏ

The S3016 is specially designed to inspect THD and SMD selective solder joints on double-sided PCBs and for other similar applications.

 
Owens Corning's new grades of PerforMax® glass fibers set new standards in reinforcement technology
2006/10/24, È­¿äÀÏ
Innovative products offer low outgassing and enhanced hydrolytic resistance bringing higher performance and productivity benefits.

 

 
PROMATION provides low-cost post-AOI sorting solution
2006/10/24, È­¿äÀÏ
PROMATION announces that it can provide numerous versions of equipment for post-AOI sorting and rework.

 

 
ZESTRON America introduces latest product development: ATRON AC 205
2006/10/24, È­¿äÀÏ
This new generation of monoethanolamine-free, alkaline-aqueous-based cleaning agents can be used as a drop-in replacement for high and medium pressure, inline and batch cleaning systems.
 
LIN slave MLX80103 enables easy LIN connection of switch modules
2006/10/24, È­¿äÀÏ

Melexis and BMW Group have jointly developed a universal configuration of the MLX80103.

 
Dispensing workstation applies same amount every time, for higher output with less rework
2006/10/24, È­¿äÀÏ

EFD's Ultra 2400 dispensing workstation removes all guesswork and variability from the fluid dispensing process.

 
CeTaQ announces software upgrade for faster results, machine performance fixes
2006/10/20, ±Ý¿äÀÏ

CeTaQ Americas’ speedy, on-site machine performance verification service is now even faster due to a new software upgrade.

 
Adhesives for electronics applications
2006/10/20, ±Ý¿äÀÏ
DYMAX UV curing adhesives are ideal for wire tacking and thermal management situations.
 
National Semiconductor introduces new family of LED drivers to power high-brightness LEDs
2006/10/20, ±Ý¿äÀÏ

Optimised for industrial and automotive led applications, new family provides constant current through LEDs and features low feedback voltage to minimise power dissipation.

 
Hesse & Knipps reveals benefits of new heavy wire bonder
2006/10/20, ±Ý¿äÀÏ

Shipments to customers planned for early 2007.

 
Aeroflex & AT4 wireless launch Development Test Mode for WiMAX Forum’s 802.16e protocol conformance
2006/10/20, ±Ý¿äÀÏ
Gives early product developers opportunity to test both subscriber and basestation functionality.

 

 
Denali DDR controller IP product enables Mobileye’s next-generation automotive technology
2006/10/18, ¼ö¿äÀÏ

Databahn Mobile DDR solution addresses technology-based safety systems 

 
VMS400 mini spool valve for low to high viscosity fluids
2006/10/18, ¼ö¿äÀÏ

Up to 700 lbs fluid pressure can be applied with I&J Fisnar's new valve, making it possible to dispense viscose fluids, such as pastes and gels.

 
24V DC-powered LVDT position sensors provide true zero to 10V output
2006/10/18, ¼ö¿äÀÏ

Easily integrates with PLCs, digital indicators and QC systems in the field. 

 
Newest version of Applied Stats software includes simplified Chinese language capability
2006/10/13, ±Ý¿äÀÏ

Device drivers are also now available in Unicode. 

 
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