6.9 - Improved BGA shock and bend performance using corner glue epoxies
2006/12/01, 금요일
The adoption of lead free solders has decreased the reliability of BGA packages subjected to shock and bend events. Also, as BGA packages grow in footprint and as pitches shrink, they are at increased risk of failure induced through handling. Capillary flow underfills can be used to significantly enhance the reliability performance of BGA packages. However, underfilling larger packages can take significant time. This can translate to slow assembly rates or multiple underfill machines operating in parallel to meet throughput requirements.
This article originally appeared in Global SMT & Packaging magazine 6.9 - October 2006.
The adoption of lead free solders has decreased the reliability of BGA packages subjected to shock and bend events. Also, as BGA packages grow in footprint and as pitches shrink, they are at increased risk of failure induced through handling. Capillary flow underfills can be used to significantly enhance the reliability performance of BGA packages. However, underfilling larger packages can take significant time. This can translate to slow assembly rates or multiple underfill machines operating in parallel to meet throughput requirements.
