This paper will help you understand the process of lead-free rework of package-on-package (POP) mounted on a PCB, which is new technology already being used in high-end graphics cards and mobile phones. Because most PCBs are double-sided, it is important not to reflow or damage opposite side packages when reworking POP.
Herein, POP rework will be discussed, including issues with lead-free processes, processing double-sided boards and advantages versus limitations of various process options. Read the full article (PDF)...
This article was taken from Global SMT & Packaging Vol. 7 No. 4 - April 2007
This paper will help you understand the process of lead-free rework of package-on-package (POP) mounted on a PCB, which is new technology already being used in high-end graphics cards and mobile phones. Because most PCBs are double-sided, it is important not to reflow or damage opposite side packages when reworking POP.
