The Tin Whisker User Group of the International Electronics Manufacturing Initiative (iNEMI) released a major update of its publication 밨ecommendations on Lead-Free Finishes for Components Used in High-Reliability Products� at the end of last year. This latest revision includes significant changes to some of the group뭩 previous recommendations as well as addition of new recommendations regarding such issues as corrosion, bias, use of tin over brass or tin over steel, circuit board assembly, and non-columnar grain structure. They have also expanded their discussion of bright tin, making formal recommendations regarding its use. This article discusses some of the more significant updates/revisions. Read the full article (PDF)...
This article was taken from Global SMT & Packaging Vol. 7 No. 6 - June 2007
The Tin Whisker User Group of the International Electronics Manufacturing Initiative (iNEMI) released a major update of its publication 밨ecommendations on Lead-Free Finishes for Components Used in High-Reliability Products� at the end of last year. This latest revision includes significant changes to some of the group뭩 previous recommendations as well as addition of new recommendations regarding such issues as corrosion, bias, use of tin over brass or tin over steel, circuit board assembly, and non-columnar grain structure. They have also expanded their discussion of bright tin, making formal recommendations regarding its use. This article discusses some of the more significant updates/revisions. 
