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9.2 - March/April 2009 Àμâ À̸ÞÀÏ
2009/04/21, È­¿äÀÏ

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Issue 9.1 January/February 2009

- Editorial -

¾Æ¹«µµ °¡Áö ¾Ê´Â ±æ, »õ·Î¿î ±âȸ¸¦ ã¾Æ¼­
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- TECHNOLOGY FOCUS -
´ë¾ÈÀû ¹«¿¬ ¼Ö´õ ÇÕ±ÝÀÇ Æò°¡¸¦ À§ÇÑ Å×½ºÆ® µ¥ÀÌÅÍ ¿ä°Ç
Gregory Henshall, Hewlett-Packard Company

SMT¿¡¼­ SPC Àû¿ë ¹× »ç¿ë»ó ¾î·Á¿î Á¡
Mathias Keil, CeTaQ, Radeberg, Germany

°øÁ¤¼º´É Áö¼ö: ÃÖÀûÀÇ Àåºñ ¼º´É Æò°¡ ¹æ¹ý
Rita Mohanty, Speedline Technologies Inc.

´ÜÀÏ °øÁ¤À¸·Î ¹«¿¬ ¹× À¯¿¬ PCB Ŭ¸®´×À» ÇÒ ¼ö Àִ°¡?
Dipl. Ing. Stefan Strixner, ZESTRON Europe

·¹ÀÌÀú – À¯¿¬ÇÑ PCB ¸®¿öÅ© Åø
Bob Wettermann, CIT, BEST In., & Rolling Meadows

- SPECIAL FEATURES -
ÀÎÅͺä: Áõ±â À§»ó Àåºñ ¼±µµ¾÷ü, R&D Å×Å©´ÏÄà ¼­ºñ½º
À̺ñµå ½´ÄÚ³Ù(David Suihkonen) »çÀå/ R&D Technical Services Inc.

Àü½Ãȸ ÇÁ¸®ºä: SMT/PCB • PACKAGING & NEPCON KOREA 2009 Preview
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- REGULAR COLUMN -
¹«¿¬ ¼Ö´õ ´ëÀÀ Ç¥¸é¼¼Á¤°ú ¸®ÇÃ·Î¿ì °øÁ¤
¹æÁ¤È¯ Çѱ¹»ý»ê±â¼ú¿¬±¸¿ø ¿ëÁ¢Á¢ÇÕ±â¼úÁö¿ø¼¾ÅÍ

2009 & 2010: Àü¼¼°è °æ±â ȸº¹
Walt Custer


- OTHER REGULAR FEATURES -

Industry News
New Products 
Association News
International Diary

 
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