|
PDF ÆÄÀÏ·Î ÀâÁö ¹«·á º¸±â
Çѱ¹ÆÇ
Issue 9.1 January/February 2009
- Editorial -
¾Æ¹«µµ °¡Áö ¾Ê´Â ±æ, »õ·Î¿î ±âȸ¸¦ ã¾Æ¼
±èÁøÈñ ÆíÁýÀå
- TECHNOLOGY FOCUS -
´ë¾ÈÀû ¹«¿¬ ¼Ö´õ ÇÕ±ÝÀÇ Æò°¡¸¦ À§ÇÑ Å×½ºÆ® µ¥ÀÌÅÍ ¿ä°Ç
Gregory Henshall, Hewlett-Packard Company
SMT¿¡¼ SPC Àû¿ë ¹× »ç¿ë»ó ¾î·Á¿î Á¡
Mathias Keil, CeTaQ, Radeberg, Germany
°øÁ¤¼º´É Áö¼ö: ÃÖÀûÀÇ Àåºñ ¼º´É Æò°¡ ¹æ¹ý
Rita Mohanty, Speedline Technologies Inc.
´ÜÀÏ °øÁ¤À¸·Î ¹«¿¬ ¹× À¯¿¬ PCB Ŭ¸®´×À» ÇÒ ¼ö Àִ°¡?
Dipl. Ing. Stefan Strixner, ZESTRON Europe
·¹ÀÌÀú – À¯¿¬ÇÑ PCB ¸®¿öÅ© Åø
Bob Wettermann, CIT, BEST In., & Rolling Meadows
- SPECIAL FEATURES -
ÀÎÅͺä: Áõ±â À§»ó Àåºñ ¼±µµ¾÷ü, R&D Å×Å©´ÏÄà ¼ºñ½º
À̺ñµå ½´ÄÚ³Ù(David Suihkonen) »çÀå/ R&D Technical Services Inc.
Àü½Ãȸ ÇÁ¸®ºä: SMT/PCB • PACKAGING & NEPCON KOREA 2009 Preview
±èÁøÈñ ÆíÁýÀå
- REGULAR COLUMN -
¹«¿¬ ¼Ö´õ ´ëÀÀ Ç¥¸é¼¼Á¤°ú ¸®ÇÃ·Î¿ì °øÁ¤
¹æÁ¤È¯ Çѱ¹»ý»ê±â¼ú¿¬±¸¿ø ¿ëÁ¢Á¢ÇÕ±â¼úÁö¿ø¼¾ÅÍ
2009 & 2010: Àü¼¼°è °æ±â ȸº¹
Walt Custer
- OTHER REGULAR FEATURES -
Industry News
New Products
Association News
International Diary |