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6.4 - Single ball reballing and repair of BGA components |
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2006/04/03, 월요일 |
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 The trend of increasing complication in the rework arena continues. Sources of today뭩 rework challenges include the development of smaller and smaller components and the continued difficulty of reworking BGAs (with defective, deformed, or missing balls). Add to that, the necessity for contract manufacturers to have a reliable solution to reduce waste continues.
The need exists to blend 몋ypical� rework (SMD components, lead-free solder and 0201) with more complex rework, such as single ball reballing. Or, simply put, to reuse BGA components that have failed capillarity tests or have arrived from the manufacturer as defective parts.
This article originally appeared in Global SMT & Packaging magazine 6.4 - Apr 2006.
Download the full article (free) in PDF format.
Robert Avila is the Western Regional Manager for Finetech, located in Phoenix, Arizona. Robert has numerous years of experience as a process and application engineer in the assembly industry, with previous positions at Motorola and Emcore in New Mexico.
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