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IPC/JEDEC 2006 International Conferences on Lead Free Electronic Assemblies and Components seek presentations from environmental managers and technical staff on relevant subjects for the following conference dates:
October 9-11, 2006 � Singapore
October 30-November 1, 2006 � Frankfurt, Germany
December 4-6, 2006 � Location TBD
All of the International Lead Free Conferences offer time slots between 30-45 minutes long. Some papers may be grouped together in a forum or panel discussion. To submit an abstract, please complete the second page of this form and include an abstract of 200-300 words along with a brief biography (or you may provide the same information via e-mail to
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) in accordance with the deadline shown below.
Presentation materials must be non-commercial in nature, focusing on technology rather than a company뭩 product. It is mandatory to provide a print-quality paper or hard copies of visuals for the conference proceedings in order to deliver an oral presentation
Proposals are also solicited from individuals interested in teaching full-day tutorials (six hours) or half-day workshops (three hours) to a class of up to 30 persons on topics in this area. Examples include: reliability, process issues, rework, plating and surface finishes, design for lead free, design for recycling, etc. Additional suggestions are also welcome.
An honorarium is offered to tutorial and workshop instructors. A brief description and additional information on any such proposals should be submitted according to the guidelines for abstract submission i.e. by completion of the attached form.
Deadlines for abstract submissions are:
Singapore - July 7, 2006
Frankfurt, Germany
- July 28, 2006
Location TBD - September 1, 2006
Contact
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for abstract submission instructions.
Sponsorships and Exhibits
Companies interested in information on the benefits associated with IPC/JEDEC event sponsorship or exhibiting in our tabletop exhibit, please email
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Registration Information
If you would like to receive registration information on any or all of the 2006 International Conferences on Lead Free Electronic Components and Assemblies when available, please send your contact information to
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.
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